Reaction diffusions of Cu6Sn5 and Cu3Sn intermetallic compound in the couple of Sn-3.5Ag eutectic solder and copper substrate

被引：35
|
作者：
Yoon, JW
Lee, CB
Kim, DU
Jung, SB
机构：
[1] Sungkyunkwan Univ, Adv Mat & Proc Res Ctr IT, Jangan Gu, Suwon 440746, South Korea
[2] Samsung Electro Mech Co Ltd, R&D Ctr, Paldal Gu, Suwon 442743, South Korea
[3] Hyundai MOBIS Co, Inst Res, Yongin 449910, South Korea
来源：
METALS AND MATERIALS INTERNATIONAL | 2003年 / 9卷 / 02期
关键词：
Sn-3.5Ag solder; intermetallic compound; growth kinetics; activation energy; isothermal aging;
D O I：
10.1007/BF03027277
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The growth kinetics of intermetallic compound layers formed between Sn-3.5Ag solder and Cu substrate were investigated as a consequence of solid-state isothermal aging. Isothermal aging was carried out in a temperature range between 70degreesC and 200degreesC for 0 to 60 days. A quantitative analysis of the intermetallic compound layer thickness as a function of time and temperature was performed. The diffusion couples showed a composite intermetallic layer comprised Of Cu6Sn5 and Cu3Sn. The growth of intermetallic compounds followed diffusion-controlled kinetics and the layer thickness reached only 9 mum after 60 day of aging at 150degreesC. The apparent activation energies were calculated for the growth of the total intermetallic compound (Cu6Sn5 + Cu3Sn); Cu6Sn5 and Cu3Sn intermetallic are 65.4, 55.4 and 75.7 kJ/mol, respectively.
引用
收藏
页码：193 / 199
页数：7
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