X-ray absorption studies of high performance Low-k dielectric materials

被引:0
|
作者
Yoda, T [1 ]
Miyajima, H [1 ]
Shimada, M [1 ]
Nakata, R [1 ]
Hashimoto, H [1 ]
机构
[1] Toshiba Co Ltd, Adv ULSI Proc Engn Dept, Semicond Co, Isogo Ku, Yokohama, Kanagawa 2358522, Japan
关键词
D O I
暂无
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
The XAFS measurement of the MSQ type low-k dielectrics (LKD(TM)) was conducted to clarify the structure change with and without the EB cure. Furthermore, three different types of other MSQ films, the ladder structure, the random structure and the CVD film, have been investigated as references. We have determined Si-O-Si bond angle and Si-O(Si-C) bond length by fitting the Fourier transformed EXAFS spectra. The ladder structure and the random structure have Si-O-Si bond angle of 133 and 146, respectively. Si-O-Si bond angle of LKD(TM) film is among that of the ladder and the random structure, and the XANES spectrum of LKD(TM) film displays two broad features, corresponding to the mixture of both structures. In contrast, Si-O-Si angles of the EB cured LKD(TM) film and the CVD film resemble each other, and the XANES features of both films are almost identical with that of the random structure. We have confirmed that the EB cure process for LKD(TM) film makes drastic structure change from the mixture of ladder and random structure to the random network structure.
引用
收藏
页码:67 / 72
页数:6
相关论文
共 50 条
  • [21] Measurement of the vacuum-ultraviolet absorption spectrum of low-k dielectrics using X-ray reflectivity
    Choudhury, F. A.
    Nguyen, H. M.
    King, S. W.
    Lee, C. H.
    Lin, Y. H.
    Fung, H. S.
    Chen, C. C.
    Li, W.
    Benjamin, D.
    Blatz, J. M.
    Nishi, Y.
    Shohet, J. L.
    APPLIED PHYSICS LETTERS, 2018, 112 (08)
  • [22] SIMS studies of low-K materials
    Lin, Xue-Feng
    Smith, Stephen P.
    THIN SOLID FILMS, 2006, 515 (03) : 1087 - 1092
  • [23] Moisture Impact on Dielectric Reliability in Low-k Dielectric Materials
    Lee, Ki-Don
    Yuan, Quan
    Patel, Anuj
    Mai, Zack Tran
    Brown, Logan H.
    English, Steven
    2016 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS), 2016,
  • [24] Characterizing high-k and low-k dielectric materials for semiconductors:: Progress and challenges
    Bennett, J.
    Quevedo-Lopez, M.
    Satyanarayana, S.
    APPLIED SURFACE SCIENCE, 2006, 252 (19) : 7167 - 7171
  • [25] X-ray photoelectron spectroscopic study of surface modification of low-k organic materials by plasma treatment
    Uchida, Y
    Fukuda, T
    Yanazawa, H
    SURFACE AND INTERFACE ANALYSIS, 2004, 36 (08) : 677 - 680
  • [26] X-ray photoernission and X-ray absorption studies of Hf-silicate dielectric layers
    O'Connor, R.
    Hughes, G.
    Glans, P-A.
    Learmonth, T.
    Smith, K. E.
    APPLIED SURFACE SCIENCE, 2006, 253 (05) : 2770 - 2775
  • [27] Nano-indentation studies of xerogel and SiLK low-K dielectric materials
    A. K. Sikder
    I. M. Irfan
    Ashok Kumar
    J. M. Anthony
    Journal of Electronic Materials, 2001, 30 : 1527 - 1531
  • [28] Nano-indentation studies of Xerogel and SiLK low-K dielectric materials
    Sikder, AK
    Irfan, IM
    Kumar, A
    Anthony, JM
    JOURNAL OF ELECTRONIC MATERIALS, 2001, 30 (12) : 1527 - 1531
  • [29] Study of the effect of dielectric porosity on the stress in advanced Cu/low-k interconnects using x-ray diffraction
    Wilson, C. J.
    Zhao, C.
    Zhao, L.
    Metzger, T. H.
    Tokei, Zs.
    Croes, K.
    Pantouvaki, M.
    Beyer, G. P.
    Horsfall, A. B.
    O'Neill, A. G.
    APPLIED PHYSICS LETTERS, 2009, 94 (18)
  • [30] Anisotropic elastic properties of low-k dielectric materials
    Maznev, AA
    Mazurenko, A
    Alper, G
    Moore, CJL
    Gostein, M
    MATERIALS, TECHNOLOGY AND RELIABILITY FOR ADVANCED INTERCONNECTS AND LOW-K DIELECTRICS-2004, 2004, 812 : 67 - 72