Experimental Determination and Thermodynamic Modeling of the Sn-Rich Corner of the Ternary Ni-Pd-Sn Phase Diagram at 250°C

被引:7
|
作者
Rahman, Md. Arifur [1 ]
Ho, Cheng En [1 ]
Gierlotka, Wojciech [2 ]
Kuo, Jui Chao [3 ]
机构
[1] Yuan Ze Univ, Dept Chem Engn & Mat Sci, Chungli 320, Taoyuan, Taiwan
[2] Natl Dong Hwa Univ, Dept Mat Sci & Engn, Shoufeng 97401, Hualien, Taiwan
[3] Natl Cheng Kung Univ, Dept Mat Sci & Engn, Tainan 701, Taiwan
关键词
Ni-Pd-Sn isotherm; Muggianu method; CALPHAD; EBSD; SOLDER JOINTS; MICROSTRUCTURAL EVOLUTION; ALLOYS; TIN; SN-3AG-0.5CU; THICKNESS; AG;
D O I
10.1007/s11664-014-3330-z
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The Sn-rich portion of the phase diagram for the Ni-Pd-Sn ternary system was preliminarily obtained by interpolation of the three constituent binary systems using the Muggianu method. Based on this proposition, 23 Ni-Pd-Sn alloys were prepared and annealed at 250 degrees C. The annealed alloys were analyzed by scanning electron microscopy, electron probe microanalysis, electron backscatter diffraction, and x-ray diffraction. All the binaries adjacent to the Sn-rich corner (i.e., PdSn4, PdSn3, PdSn2, and Ni3Sn4) were found to have remarkable ternary solubility. The experimental results presented herein, together with a thermodynamic interpolation of the ternary system based on the results from the binary systems, were used to calculate the ternary phase diagram using the calculation of phase diagrams (CALPHAD) method. A substitution model was used to describe the Gibbs free energies of the liquid and solid solution phases, and a sublattice model was used to describe intermetallic compounds. A consistent set of thermodynamic parameters was obtained, ultimately leading to a better fit between the calculated results and the experimental data for this system.
引用
收藏
页码:4582 / 4593
页数:12
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