The microstructure and electrical properties of directly deposited TiN ohmic contacts to gallium nitride.

被引:0
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作者
Ruterana, P
Nouet, G
Kehagias, T
Komninou, P
Karakostas, T
Poisson, MAD
Huet, F
机构
[1] ISMRA, Lab Etud & Rech Mat, CNRS, UPRESA 6004, F-14050 Caen, France
[2] Thomson CSF, Cent Rech Lab, F-91404 Orsay, France
[3] Aristotelian Univ Salonika, Dept Phys, GR-54006 Salonika, Greece
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T [工业技术];
学科分类号
08 ;
摘要
When the stoichiometric TIN was deposited directly on GaN, we obtained columnar TiN grains of 5-20 nm section which cross the whole film thickness and are rotated mostly around the [111] axis. The conventional epitaxial relationship is obtained and no amorphous patches are observed at the interface. The deposition of TiN on Si doped GaN layers lead to the formation of an ohmic contact, whereas we obtain a rectifying contact on p type layers.
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页码:art. no. / W11.75
页数:6
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