Revisiting mechanisms to inhibit Ag3Sn plates in Sn-Ag-Cu solders with 1 wt.% Zn addition

被引：40
|
作者：
Luo, Z. -B. [1 ]
Zhao, J. [1 ]
Gao, Y. -J. [1 ]
Wang, L. [1 ]
机构：
[1] Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China
来源：
JOURNAL OF ALLOYS AND COMPOUNDS | 2010年 / 500卷 / 01期
关键词：
Sn-Ag-Cu; Zn; Ag3Sn; (Cu; Ag)(5)Zn-8; Cooling rate; INTERMETALLIC COMPOUNDS; LEAD-FREE; ALLOYS; SOLIDIFICATION; INTERFACE; GROWTH; BEHAVIOR; JOINTS;
D O I：
10.1016/j.jallcom.2010.03.191
中图分类号：
O64 [物理化学（理论化学）、化学物理学];
学科分类号：
070304 ; 081704 ;
摘要：
Two mechanisms to inhibit Ag3Sn plates were discovered in Sn-1.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu with 1 wt.% Zn addition. It was revealed that 1 wt.% Zn not only reduced the supercooling of beta-Sn, but also promoted the formation of gamma-(Cu,Ag)(5)Zn-8 compounds. The amount of gamma-(Cu,Ag)(5)Zn-8 was larger in Sn-3.0Ag-0.5Cu than that in Sn-1.0Ag-0.5Cu. Meanwhile, the Ag content in gamma-(Cu,Ag)(5)Zn-8 was higher in the high-Ag solder. Although more gamma particles formed under slow cooling rate, the Ag content varied a little with cooling rate. (C) 2010 Elsevier B.V. All rights reserved.
引用
收藏
页码：39 / 45
页数：7
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