Revisiting mechanisms to inhibit Ag3Sn plates in Sn-Ag-Cu solders with 1 wt.% Zn addition

被引：40
|
作者：
Luo, Z. -B. [1 ]
Zhao, J. [1 ]
Gao, Y. -J. [1 ]
Wang, L. [1 ]
机构：
[1] Dalian Univ Technol, Sch Mat Sci & Engn, Dalian 116024, Peoples R China
来源：
JOURNAL OF ALLOYS AND COMPOUNDS | 2010年 / 500卷 / 01期
关键词：
Sn-Ag-Cu; Zn; Ag3Sn; (Cu; Ag)(5)Zn-8; Cooling rate; INTERMETALLIC COMPOUNDS; LEAD-FREE; ALLOYS; SOLIDIFICATION; INTERFACE; GROWTH; BEHAVIOR; JOINTS;
D O I：
10.1016/j.jallcom.2010.03.191
中图分类号：
O64 [物理化学（理论化学）、化学物理学];
学科分类号：
070304 ; 081704 ;
摘要：
Two mechanisms to inhibit Ag3Sn plates were discovered in Sn-1.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu with 1 wt.% Zn addition. It was revealed that 1 wt.% Zn not only reduced the supercooling of beta-Sn, but also promoted the formation of gamma-(Cu,Ag)(5)Zn-8 compounds. The amount of gamma-(Cu,Ag)(5)Zn-8 was larger in Sn-3.0Ag-0.5Cu than that in Sn-1.0Ag-0.5Cu. Meanwhile, the Ag content in gamma-(Cu,Ag)(5)Zn-8 was higher in the high-Ag solder. Although more gamma particles formed under slow cooling rate, the Ag content varied a little with cooling rate. (C) 2010 Elsevier B.V. All rights reserved.
引用
收藏
页码：39 / 45
页数：7
相关论文
共 50 条
  • [1] Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni
    Hammad, A. E.
    El-Taher, A. M.
    JOURNAL OF ELECTRONIC MATERIALS, 2014, 43 (11) : 4146 - 4157
  • [2] Mechanical Deformation Behavior of Sn-Ag-Cu Solders with Minor Addition of 0.05 wt.% Ni
    A.E. Hammad
    A.M. El-Taher
    Journal of Electronic Materials, 2014, 43 : 4146 - 4157
  • [3] Formation of Ag3Sn plates in Sn-Ag-Cu alloys and optimization of their alloy composition
    Kang, SK
    Choi, WK
    Shih, DY
    Henderson, DW
    Gosselin, T
    Sarkhel, A
    Goldsmith, C
    Puttlitz, KJ
    53RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2003 PROCEEDINGS, 2003, : 64 - 70
  • [4] Nucleation and growth of Ag3Sn in Sn-Ag and Sn-Ag-Cu solder alloys
    Cui, Y.
    Xian, J. W.
    Zois, A.
    Marquardt, K.
    Yasuda, H.
    Gourlay, C. M.
    ACTA MATERIALIA, 2023, 249
  • [5] The effect of Ag content on the formation of Ag3Sn plates in Sn-Ag-Cu lead-free solder
    Huann-Wu Chiang
    Kenndy Chang
    Jun-Yuan Chen
    Journal of Electronic Materials, 2006, 35 : 2074 - 2080
  • [6] The effect of Ag content on the formation of Ag3Sn plates in Sn-Ag-Cu lead-free solder
    Chiang, Huann-Wu
    Chang, Kenndy
    Chen, Jun-Yuan
    JOURNAL OF ELECTRONIC MATERIALS, 2006, 35 (12) : 2074 - 2080
  • [7] Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying addition
    Sung K. Kang
    Donovan Leonard
    Da-Yuan Shih
    Lynne Gignac
    D. W. Henderson
    Sungil Cho
    Jin Yu
    Journal of Electronic Materials, 2006, 35 : 479 - 485
  • [8] Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying addition
    Kang, SK
    Leonard, D
    Shih, DY
    Gignac, L
    Henderson, DW
    Cho, S
    Yu, J
    JOURNAL OF ELECTRONIC MATERIALS, 2006, 35 (03) : 479 - 485
  • [9] Modeling of Ag3Sn coarsening and its effect on creep in Sn-Ag-Cu solder
    Wang, Xiaojing
    Zhu, Qingsheng
    Wang, Zhongguang
    Shang, Jianku
    Jinshu Xuebao/ Acta Metallurgica Sinica, 2009, 45 (08): : 912 - 918
  • [10] MODELING OF Ag3Sn COARSENING AND ITS EFFECT ON CREEP IN Sn-Ag-Cu SOLDER
    Wang Xiaojing
    Zhu Qingsheng
    Wang Zhongguang
    Shang Jianku
    ACTA METALLURGICA SINICA, 2009, 45 (08) : 912 - 918
12345