Fabrication and Characterization of a Polycrystalline 3C-SiC Piezoresistive Micro-pressure Sensor

被引:8
|
作者
Chung, Gwiy-Sang [1 ]
机构
[1] Univ Ulsan, Sch Elect Engn, Ulsan 680749, South Korea
关键词
Pressure sensor; Poly; 3C-SiC; Harsh environments; SOI;
D O I
10.3938/jkps.56.1759
中图分类号
O4 [物理学];
学科分类号
0702 ;
摘要
This paper describes polycrystalline (poly) 3C-SiC piezoresistive micro-pressure sensors for extreme environment applications prepared with a combination crystal growth technology using chemical vapor deposition (CVD) and micromachining techniques. The device was designed using bulk micromachining tinder a 1. x 1 mm(2) diaphragm and a Si membrane with a thickness of 20 mu m. The pressure sensitivities of the fabricated pressure sensors were 0.1 mV/V.bar. The nonlinearity of the devices was +/- 0.44%.FS, and the hysteresis was 0.61%.FS. The temperature characteristics of the temperature coefficient of sensitivity (TCS), the temperature coefficient of resistance (TOR.), and the temperature coefficient of the gauge factor (TCGF) were also evaluated. The TCS of the pressure sensors was -1,867 ppm/degrees C, the TCR was -792 ppm/degrees C, and the TCGF to 5 bars was -1,042 ppm/degrees C, from 25 to 400 degrees C.
引用
收藏
页码:1759 / 1762
页数:4
相关论文
共 50 条
  • [21] A Micromachined Resonant Micro-Pressure Sensor
    Zhang, Sen
    Zheng, Yu
    Lu, Yulan
    Xie, Bo
    Chen, Deyong
    Wang, Junbo
    Chen, Jian
    IEEE SENSORS JOURNAL, 2021, 21 (18) : 19789 - 19796
  • [22] Epitaxial growth and characterization of graphene on free-standing polycrystalline 3C-SiC
    Huang, Han
    Wong, Swee Liang
    Tin, Chin-Che
    Luo, Zhi Qiang
    Shen, Ze Xiang
    Chen, Wei
    Wee, Andrew Thye Shen
    JOURNAL OF APPLIED PHYSICS, 2011, 110 (01)
  • [23] Electrical and Mechanical Characterization of Doped and Annealed Polycrystalline 3C-SiC Thin Films
    Roper, Christopher S.
    Radmilovic, Velimir
    Howe, Roger T.
    Maboudian, Roya
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2009, 156 (01) : D5 - D10
  • [24] Characterization of polycrystalline 3C-SiC thin film diodes for extreme environment applications
    Chung, Gwiy-Sang
    Ahn, Jeong-Hak
    MICROELECTRONIC ENGINEERING, 2008, 85 (08) : 1772 - 1775
  • [25] Migration behaviour of selenium implanted into polycrystalline 3C-SiC
    Abdalla, Z. A. Y.
    Ismail, M. Y. A.
    Njoroge, E. G.
    Hlatshwayo, T. T.
    Wendler, E.
    Malherbe, J. B.
    VACUUM, 2020, 175
  • [26] Single Crystal and Polycrystalline 3C-SiC for MEMS Applications
    Henry, Anne
    Janzen, Erik
    Mastropaolo, Enrico
    Cheung, Rebecca
    SILICON CARBIDE AND RELATED MATERIALS 2008, 2009, 615-617 : 625 - 628
  • [27] Fracture of polycrystalline 3C-SiC films in microelectromechanical systems
    Gao, D
    Carraro, C
    Radmilovic, V
    Howe, RT
    Maboudian, R
    JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, 2004, 13 (06) : 972 - 976
  • [28] Microstructure analysis on polycrystalline 3C-SiC thin films
    Ricciardi, C
    Giorgis, F
    Fanchini, G
    Musso, S
    Ballarini, V
    Bennici, E
    Barucca, G
    Rossi, AM
    DIAMOND AND RELATED MATERIALS, 2005, 14 (3-7) : 1134 - 1137
  • [29] MECHANICAL-PROPERTIES OF POLYCRYSTALLINE 3C-SIC DEPOSITS
    IVANOVA, LM
    KOPEV, IM
    BOTVINA, LR
    INORGANIC MATERIALS, 1995, 31 (09) : 1101 - 1104
  • [30] Optical characteristics of polycrystalline 3C-SiC for harsh environments
    Jeong, Junho
    Chung, Gwiy-Sang
    EDM 2007: 8TH INTERNATIONAL WORKSHOP AND TUTORIALS ON ELECTRON DEVICES AND MATERIALS, 2007, : 34 - 36