Generation-recombination noise in advanced CMOS devices

被引:2
|
作者
Simoen, E. [1 ]
Oliveira, A. V. [2 ]
Boudier, D. [3 ]
Mitard, J. [1 ]
Witters, L. [1 ]
Veloso, A. [1 ]
Agopian, P. G. D. [2 ]
Martino, J. A. [2 ]
Carin, R. [3 ]
Cretu, B. [3 ]
Langer, R. [1 ]
Collaert, N. [1 ]
Thean, A. [1 ]
Claeys, C. [4 ]
机构
[1] IMEC, Kapeldreef 75, B-3001 Leuven, Belgium
[2] Univ Sao Paulo, LSI, Sao Paulo, Brazil
[3] Univ Caen Normandie, GREYC, UMR 6072, ENSICAEN, F-14000 Caen, France
[4] Katholieke Univ Leuven, Dept Elect Engn, Kasteelpk 10, B-3001 Leuven, Belgium
关键词
LOW-FREQUENCY-NOISE; UTBOX SOI NMOSFETS; TEMPERATURE; FINFETS; SPECTROSCOPY; VARIABILITY; DEFECTS; TIME;
D O I
10.1149/07505.0111ecst
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
This paper gives an overview of the occurrence of Generation-Recombination (GR) noise in advanced submicron Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs). GR noise corresponds with a Lorentzian spectrum, characterized by a plateau amplitude and a corner frequency. Studying the gate voltage dependence of these parameters enables to distinguish trap centers in the depletion region of the semiconductor or in the gate dielectric. In the latter case, single defects are at the origin of the Lorentzian spectrum, which usually give rise to two-level fluctuations in the time domain, also called Random Telegraph Signals (RTSs). Here, it will be outlined how information regarding the energy level (E-T), the trap concentration (N-T) or the trap position can be extracted from studying the GR noise as a function of temperature or gate voltage.
引用
收藏
页码:111 / 120
页数:10
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