In-line automatic defect classification

被引：0

作者：

Bennett, MH ^{[1
]}

Garvin, JF ^{[1
]}

Coldren, D ^{[1
]}

机构：

[1] Texas Instruments Inc, Mfg Sci & Technol, Dallas, TX 75243 USA

来源：

1997 IEEE INTERNATIONAL SYMPOSIUM ON SEMICONDUCTOR MANUFACTURING CONFERENCE PROCEEDINGS | 1997年

关键词：

D O I：

10.1109/ISSM.1997.664582

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Manual review of wafers and classification of defects is a slow, tedious process. While identification of defects is important, this step in wafer fabrication can be a bottleneck to throughput The accuracy of human classification can very from day to day and person to person. In-line Automatic Defect Classification (ADC) is an emerging technology aimed at solving this problem[1].

引用

页码：E29 / E30

页数：2

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