In-line automatic defect classification

被引：0
|
作者：
Bennett, MH [1 ]
Garvin, JF [1 ]
Coldren, D [1 ]
机构：
[1] Texas Instruments Inc, Mfg Sci & Technol, Dallas, TX 75243 USA
来源：
1997 IEEE INTERNATIONAL SYMPOSIUM ON SEMICONDUCTOR MANUFACTURING CONFERENCE PROCEEDINGS | 1997年
关键词：
D O I：
10.1109/ISSM.1997.664582
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Manual review of wafers and classification of defects is a slow, tedious process. While identification of defects is important, this step in wafer fabrication can be a bottleneck to throughput The accuracy of human classification can very from day to day and person to person. In-line Automatic Defect Classification (ADC) is an emerging technology aimed at solving this problem[1].
引用
收藏
页码：E29 / E30
页数：2
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