DM Interference Propagation Mathematical Modeling in SiC Wirebond Multichip Power Module

被引：0
|
作者：
Chen, Xiliang [1 ]
Chen, Wenjie [1 ]
Ren, Yu [2 ]
Yang, Xu [1 ]
Qiao, Liang [3 ]
机构：
[1] Xi An Jiao Tong Univ, Dept Elect Engn, Xian 710049, Peoples R China
[2] Taiyuan Univ Technol, Shanxi Key Lab Power Syst Operat & Control, Taiyuan 030024, Peoples R China
[3] Univ Tennessee, Elect Engn & Comp Sci Dept, Knoxville, TN 37996 USA
来源：
IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS II-EXPRESS BRIEFS | 2021年 / 68卷 / 06期
基金：
中国国家自然科学基金;
关键词：
Silicon carbide; MOSFET; Couplings; Electromagnetic interference; Mathematical model; Capacitors; Multichip modules; SiC MOSFET; parallel-connected; mathematical modeling; inductive coupling; EMI; differential-mode interference; decoupling capacitors; NOISE;
D O I：
10.1109/TCSII.2020.3041675
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this brief, a novel differential-mode (DM) interference propagation mathematical modeling method based on parasitic inductive coupling theory for SiC wirebond multichip power module (SWMPM) with adjacent decoupling capacitor is proposed. Based on the proposed model, the strong and weak inductive coupling theory of DM interference equivalent circuit is proposed. And the influence of different position of decoupling capacitors on DM equivalent current is mathematically analyzed. A custom-made 1.2kV 160A power module based on DM interference optimized layout is built. It is compared with a commercial SiC power module, which can verify the feasibility and validity of the theoretical analysis.
引用
收藏
页码：2077 / 2081
页数：5
相关论文
共 46 条
  • [1] SiC Wirebond Multichip Phase-Leg Module Packaging Design and Testing for Harsh Environment
    Ning, Puqi
    Lai, Rixin
    Huff, Daniel
    Wang, Fei
    Ngo, Khai D. T.
    Immanuel, Vikram D.
    Karimi, Kamiar J.
    IEEE TRANSACTIONS ON POWER ELECTRONICS, 2010, 25 (01) : 16 - 23
  • [2] Parasitic Inductance Modeling and Reduction for a Wire Bonded Half Bridge SiC MOSFET Multichip Power Module
    Zhang, Boyi
    Wang, Shuo
    THIRTY-FOURTH ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION (APEC 2019), 2019, : 656 - 663
  • [3] Design and evaluation of SiC multichip power module with low and symmetrical inductance
    Shao Weihua
    Li Ran
    Zeng Zheng
    Li Xiaoling
    Mawby, Philip
    JOURNAL OF ENGINEERING-JOE, 2019, (17): : 3573 - 3577
  • [4] Thermal Decouple Design of Multichip SiC Power Module With Thermal Anisotropic Graphite
    Fukunaga, Shuhei
    Funaki, Tsuyoshi
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2021, 11 (05): : 778 - 784
  • [5] Experimental Validation of CT-Snubber for Multichip SiC MOSFET Power Module
    Fu, Bo
    Shahabi, Ali
    Freeborn, Todd J.
    Lemmon, Andrew N.
    Kisacikoglu, Mithat C.
    2020 IEEE 63RD INTERNATIONAL MIDWEST SYMPOSIUM ON CIRCUITS AND SYSTEMS (MWSCAS), 2020, : 419 - 423
  • [6] A Physical RC Network Model for Electrothermal Analysis of a Multichip SiC Power Module
    Li, Jianfeng
    Castellazzi, Alberto
    Eleffendi, Mohd Amir
    Gurpinar, Emre
    Johnson, Christopher Mark
    Mills, Liam
    IEEE TRANSACTIONS ON POWER ELECTRONICS, 2018, 33 (03) : 2494 - 2508
  • [7] MODELING AND ANALYSIS OF MULTICHIP-MODULE POWER-SUPPLY PLANES
    LEE, K
    BARBER, A
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING, 1995, 18 (04): : 628 - 639
  • [8] A Highly Integrated Multichip SiC MOSFET Power Module With Optimized Electrical and Thermal Performances
    Ma, Dingkun
    Xiao, Guochun
    Zhang, Tongyu
    Yang, Fengtao
    Zhu, Mengyu
    Yuan, Tianshu
    Ma, Liangjun
    Gan, Yongmei
    Wang, Laili
    IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, 2023, 11 (02) : 1722 - 1736
  • [9] High-temperature silicon carbide (SiC) power switches in multichip power module (MCPM) applications
    Hornberger, JM
    Mounce, SD
    Schupbach, RM
    Lostetter, AB
    Mantooth, HA
    Conference Record of the 2005 IEEE Industry Applications Conference, Vols 1-4, 2005, : 393 - 398
  • [10] Interleaved Planar Packaging Method of Multichip SiC Power Module for Thermal and Electrical Performance Improvement
    Yang, Fengtao
    Jia, Lixin
    Wang, Laili
    Zhang, Fan
    Wang, Binyu
    Zhao, Cheng
    Wang, Jianpeng
    Bayer, Christoph Friedrich
    Ferreira, Jan Abraham
    IEEE TRANSACTIONS ON POWER ELECTRONICS, 2022, 37 (02) : 1615 - 1629
12345