Effective work function engineering of TaxCy metal gate on Hf-based dielectrics

被引:4
|
作者
Yen, F. Y. [1 ]
Hung, C. L. [1 ]
Hou, Y. T. [1 ]
Hsu, P. F. [1 ]
Chang, V. S. [1 ]
Lim, P. S. [1 ]
Yao, L. G. [1 ]
Jiang, J. C. [1 ]
Lin, H. J. [1 ]
Chen, C. C. [1 ]
Jin, Y. [1 ]
Jang, S. M. [1 ]
Tao, H. J. [1 ]
Chen, S. C. [1 ]
Liang, M. S. [1 ]
机构
[1] Taiwan Semicond Mfg Co, R&D, Adv Module Technol Div, Hsinchu 300, Taiwan
关键词
effective work function (EWF); HfO2; HfSiON; metal gate; plasma nitridation (PN); tantalum carbide (TaC); thermal nitridation (TN);
D O I
10.1109/LED.2007.891271
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This letter reports the engineering of effective work function (EWF) for tantalum carbide (TaC) metal gate on high-k gate dielectrics. The dependence of EWF on Si concentration in HfSiO as well as nitridation techniques is revealed. The EWF was extracted by both terraced oxide and terraced high-k techniques with the bulk and interface charges taken into account. The incorporation of Si in Hf-based dielectrics results in an increase of EWE, while the presence of N tends to decrease the EWE Plasma nitridation is found to be more effective in lowering the EWF than a thermal nitridation. The phenomena can be explained by the modification of TaC/high-k interface dipole moment, which arises from the electronegativity difference for various interface bonds. Based on the above findings, we proposed a novel approach to reduce the EWF of TaC on HfSiON by using a thin HfO2 cap layer after optimizing the nitridation. The MOSFET results show that this technique is able to achieve a lower V-t without degrading the device performance.
引用
收藏
页码:201 / 203
页数:3
相关论文
共 50 条
  • [41] Role of nitrogen incorporation into Hf-based high-k gate dielectrics for termination of local current leakage paths
    Watanabe, H
    Kamiyama, S
    Umezawa, N
    Shiraishi, K
    Yoshida, S
    Watanabe, Y
    Arikado, T
    Chikyow, T
    Yamada, K
    Yasutake, K
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS, 2005, 44 (42-45): : L1333 - L1336
  • [42] Modeling of tunnelling currents in Hf-based gate stacks as a function of temperature and extraction of material parameters
    Campera, Andrea
    Iannaccone, Giuseppe
    Crupi, Felice
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2007, 54 (01) : 83 - 89
  • [43] Ultimate EOT Scaling (<5Å) Using Hf-Based High-κ Gate Dielectrics and Impact on Carrier Mobility
    Ando, Takashi
    Frank, Martin M.
    Choi, Kisik
    Choi, Changhwan
    Bruley, John
    Hopstaken, Marinus
    Haight, Richard
    Copel, Matt
    Arimura, Hiroaki
    Watanabe, Heiji
    Narayanan, Vijay
    ADVANCED GATE STACK, SOURCE/DRAIN, AND CHANNEL ENGINEERING FOR SI-BASED CMOS 6: NEW MATERIALS, PROCESSES, AND EQUIPMENT, 2010, 28 (01): : 115 - 123
  • [44] Defect passivation with fluorine and interface engineering for Hf-based High-k/Metal gate stack device reliability and performance enhancement
    Tseng, Hsing-Huang
    Tobin, Philip J.
    Kalpat, Sriram
    Schaeffer, Jamie K.
    Ramon, Michael E.
    Fonseca, Leonardo R. C.
    Jiang, Zhixiong X.
    Hegde, R. I.
    Triyoso, Dina H.
    Semavedam, S.
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2007, 54 (12) : 3267 - 3275
  • [45] The impact of stacked cap layers on effective work function with HfSiON and SiON gate dielectrics
    Cho, Hag-Ju
    Yu, Hong Yu
    Chang, Vincent S.
    Akheyar, Amal
    Jakschik, Stefan
    Conard, Thierry
    Hantschel, Thomas
    Delabie, Annelies
    Adelmann, Christoph
    Van Elshocht, Sven
    Ragnarsson, Lars-Ake
    Schram, Tom
    Absil, Philippe
    Biesemans, Serge
    IEEE ELECTRON DEVICE LETTERS, 2008, 29 (07) : 743 - 745
  • [46] Effective work function engineering by lanthanide ion implantation of metal-oxide semiconductor gate stacks
    Fet, A.
    Haeublein, V.
    Bauer, A. J.
    Ryssel, H.
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2009, 27 (01): : 290 - 293
  • [47] NMOS and PMOS triple gate devices with mid-gap metal gate on oxynitride and Hf based gate dielectrics
    Henson, K
    Collaert, N
    Demand, M
    Goodwin, M
    Brus, S
    Rooyackers, R
    van Ammel, A
    Degroote, B
    Ercken, M
    Baerts, C
    Anil, KG
    Dixit, A
    Beckx, S
    Schram, T
    Deweerd, W
    Boullart, W
    Schaekers, M
    De Gendt, S
    De Meyer, K
    Yim, Y
    Hooker, JC
    Jurczak, M
    Biesemans, S
    2005 IEEE VLSI-TSA INTERNATIONAL SYMPOSIUM ON VLSI TECHNOLOGY (VLSI-TSA-TECH), PROCEEDINGS OF TECHNICAL PAPERS, 2005, : 136 - 137
  • [48] Electrical characteristics and TDDB breakdown mechanism of N2-RTA-treated Hf-based high-κ gate dielectrics
    Lin, Cheng-Li
    Chou, Mei-Yuan
    Kang, Tsung-Kuei
    Wu, Shich-Chuan
    MICROELECTRONIC ENGINEERING, 2011, 88 (06) : 950 - 958
  • [49] Optical, structural and electrical characterizations of stacked Hf-based and silicon nitride dielectrics
    Khomenkova, L.
    Normand, P.
    Gourbilleau, F.
    Slaoui, A.
    Bonafos, C.
    THIN SOLID FILMS, 2016, 617 : 143 - 149
  • [50] Photoconductivity of Hf-based binary metal oxide systems
    Shamuilia, S.
    Afanas'ev, V. V.
    Stesmans, A.
    McCarthy, I.
    Campbell, S. A.
    Boutchich, M.
    Roeckerath, M.
    Heeg, T.
    Lopes, J. M. J.
    Schubert, J.
    JOURNAL OF APPLIED PHYSICS, 2008, 104 (11)