Surface/interface Energy Effect on Electromechanical Responses Around a Nanosized Elliptical Inclusion under Far-field Loading at an Arbitrary Angle

被引：0

作者：

Fang, Xue-Qian ^{[1
]}

Liu, Hong-Wei ^{[1
]}

Zhao, Yong-Mao ^{[1
]}

Nie, Guo-Quan ^{[1
]}

Liu, Jin-Xi ^{[1
]}

机构：

[1] Shijiazhuang Tiedao Univ, Dept Engn Mech, Shijiazhuang 050043, Peoples R China

来源：

CMC-COMPUTERS MATERIALS & CONTINUA | 2014年 / 40卷 / 02期

基金：

中国国家自然科学基金;

关键词：

Surface/interface energy electromechanical response elliptical inclusion; mapping method; HETEROGENEOUS MATERIALS; VORONOI CELLS; VOIDS;

D O I：

暂无

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

Electro-elastic surface/interface around nano-sized piezoelectric inclusions shows great effect on the response of piezoelectric nano-structures. In this paper, a theoretical model is proposed to examine the surface/interface effect on the electromechanical responses around a nano-sized elliptical piezoelectric inclusion embedded in an infinite piezoelectric matrix under far-field loading with an arbitrary angle, and the effect of loading angle is considered Combining the conformal mapping technique and electro-elastic surface/interface theory, a closed form solution of this problem is obtained and the interactive effect between the surface/interface and the aspect ratio of the elliptical inclusion is examined.

引用

页码：145 / 163

页数：19

共 16 条

[1] Surface/interface energy effect on electromechanical responses around a nanosized elliptical inclusion under far-field loading at an arbitrary angle
Fang, Xue-Qian
Liu, Hong-Wei
Zhao, Yong-Mao
Nie, Guo-Quan
Liu, Jin-Xi
Computers, Materials and Continua, 2014, 40 (02): : 145 - 163
[2] Closed-form solution for elliptical inclusion problem in antiplane piezoelectricity with far-field loading at an arbitrary angle
Mishra, D.
Park, C. Y.
Yoo, S. H.
Pak, Y. E.
EUROPEAN JOURNAL OF MECHANICS A-SOLIDS, 2013, 40 : 186 - 197
[3] Interacting Stress Intensity Factors of Multiple Elliptical-Holes and Cracks Under Far-Field and Arbitrary Surface Stresses
Yi, Wei
Rao, Qiuhua
Zhu, Wei
Shen, Qingqing
Li, Zhuo
Ma, Wenbo
ADVANCES IN APPLIED MATHEMATICS AND MECHANICS, 2022, 14 (01) : 125 - 154
[4] Interface energy effect on electromechanical response of piezoelectric composites with an arbitrary nano-inclusion under anti-plane shear
Fang, X. Q.
Liu, H. W.
Liu, J. X.
Nie, G. Q.
ACTA MECHANICA, 2015, 226 (07) : 2323 - 2333
[5] Interface energy effect on electromechanical response of piezoelectric composites with an arbitrary nano-inclusion under anti-plane shear
X. Q. Fang
H. W. Liu
J. X. Liu
G. Q. Nie
Acta Mechanica, 2015, 226 : 2323 - 2333
[6] Effect of moving resonance on the seismic responses under far-field and near-field earthquakes
Akbari J.
Rozbahani S.
Isari M.
Asian Journal of Civil Engineering, 2021, 22 (1) : 159 - 173
[7] Energy release rates for a misfitted spherical inclusion under far-field mechanical and uniform thermal loads
Pak, Y.E., 1600, Elsevier Ltd (49):
[8] Energy release rates for a misfitted spherical inclusion under far-field mechanical and uniform thermal loads
Seo, S. Y.
Mishra, D.
Park, C. Y.
Yoo, S. -H.
Pak, Y. E.
EUROPEAN JOURNAL OF MECHANICS A-SOLIDS, 2015, 49 : 169 - 182
[9] EFFECT OF PHYSICAL INTERPHASE ON MAGNETO-ELECTRO-ELASTIC (MEEJ COMPOSITES UNDER FAR-FIELD LOADING
Wang, Wei-jian
Wang, Guan-nan
Mei, Yue
PROCEEDINGS OF THE 2020 15TH SYMPOSIUM ON PIEZOELECTRCITY, ACOUSTIC WAVES AND DEVICE APPLICATIONS (SPAWDA), 2021, : 565 - 569
[10] Spherical nano-inhomogeneity with the Steigmann-Ogden interface model under general uniform far-field stress loading
Wang, Junbo
Yan, Peng
Dong, Leiting
Atluri, Satya N.
INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, 2020, 185 : 311 - 323

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