Thermo-mechanical Analysis and Fatigue Life Prediction for Integrated Circuits (ICs)

被引：2

作者：

Oukaira, Aziz ^{[1
]}

Touati, Djallel Eddine ^{[2
]}

Hassan, Ahmad ^{[1
]}

Ali, Mohamed ^{[1
]}

Savaria, Yvon ^{[1
]}

Lakhssassi, Ahmed ^{[2
]}

机构：

[1] Polytech Montreal, Elect Engn Dept, Montreal, PQ H3T 1J4, Canada

[2] Univ Quebec Outaouais, Dept Engn Comp Sci, Gatineau, PQ J8Y 3G5, Canada

来源：

2021 IEEE INTERNATIONAL MIDWEST SYMPOSIUM ON CIRCUITS AND SYSTEMS (MWSCAS) | 2021年

关键词：

Sensor interface; integrated circuits (ICs); fatigue life; thermal map; thermal stress; deformation; SOLDER JOINT RELIABILITY; EVOLUTION;

D O I：

10.1109/MWSCAS47672.2021.9531747

中图分类号：

TP [自动化技术、计算机技术];

学科分类号：

0812 ;

摘要：

This paper evaluates the thermal and thermo-mechanical behavior of a packaged sensor interface embedding several high and low-voltage integrated circuits (ICs). The main objective of this study is to apply a numerical procedure to evaluate the fatigue strength of the layers and materials that, in general, represent one of the weakest parts of integrated electronic devices. Simulations performed with COMSOL Multiphysics (R) under stable boundary conditions at 25 degrees C up to 70 degrees C and transient conditions allow to estimate and plot the thermal map of the embedded ICs. Thermal stresses and their transient distributions are obtained. In addition, the deformations are evaluated to predict the number of cycles until failure of the constituent layers.

引用

页码：630 / 634

页数：5

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