Numerical and Experimental Study of Microscale Laser Shock Processing Using Excimer Laser

被引:1
|
作者
Che, Zhigang [1 ]
Xiong, Liangcai [1 ]
Shi, Tielin [1 ]
Tang, Zirong [1 ]
Cheng, Huayang [1 ]
Yang, Likun [2 ]
机构
[1] Huazhong Univ Sci & Technol, State Key Lab Digital Mfg Equipment & Technol, Wuhan 430074, Peoples R China
[2] Wuhan Huagong Laser Engn Co Ltd, Wuhan, Peoples R China
基金
中国国家自然科学基金;
关键词
Microscale LSP; Excimer laser; Plastic deformation; Residual stress; Micro-hardness; THIN-FILMS; SIMULATION;
D O I
10.1109/NEMS.2009.5068574
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Microscale Laser Shock Processing (mu LSP) can impart compressive residual stress in Micro Electromechanical Systems (MEMS) components through laser-induced plasma and pressure pulse for improving fatigue performance and wear resistance. The excimer laser was used on mu LSP for shorter wavelength than that in previous researches. The determination method of laser spot size at micro-level spatial resolution was firstly presented. The beam sizes of 20 similar to 200 microns were used at the first time for mu LSP in simulation and experiment. Under these conditions, the characteristic parameters (including plastic deformation and residual stress) were investigated through FEM simulation and laser irradiation experiment, besides the micro-hardness being measured. The experimental results had good agreements with ones of simulation and showed the material performances were remarkably improved after mu LSP.
引用
收藏
页码:265 / +
页数:2
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