Real time X-ray imaging of soldering processes at the SPring-8 synchrotron

被引：0

作者：

Nogita, K. ^{[1
]}

Salleh, M. A. A. Mohd ^{[1
,2
]}

Zeng, G. ^{[1
,3
]}

McDonald, S. D. ^{[1
]}

Gourlay, C. ^{[3
]}

Yasuda, H. ^{[4
]}

机构：

[1] Univ Queensland, Sch Mech & Min Engn, NS CMEM, Brisbane, Qld 4072, Australia

[2] Univ Malaysia Perlis, Sch Mat Engn, Ctr Excellence Geopolymer & Green Technol, Arau 02600, Perlis, Malaysia

[3] Imperial Coll, Dept Mat, London SW7 2AZ, England

[4] Kyoto Univ, Dept Mat Sci & Engn, Sakyo Ku, Kyoto 6068501, Japan

来源：

2017 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP) | 2017年

基金：

澳大利亚研究理事会; 英国工程与自然科学研究理事会;

关键词：

lead-free solders; in-situ observations; soldering process; GROWTH; SOLIDIFICATION;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Real time X-ray imaging videos of the entire soldering process for preform solders, solder pastes and BGA solders as well as solder alloy solidification and microstructure characterisation has been achieved over numerous experiments at the SPring-8 synchrotron. This paper overviews the developments of this challenging technique and provides key findings related to understanding the reliability of solder joints. There are large difference when comparing the microstructures and solidification pathways between soldered alloys on Cu substrates (Cu-OSP) and bulk alloy solidification.

引用

页码：144 / 147

页数：4

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