Optimal Design of PCB Layout Based on Thermal Analysis Using Taguchi Method

被引：3
|
作者：
Sun Wei [1 ,2 ]
Li Ye [1 ,2 ]
Zhang Shaokun [1 ,2 ]
Shi Qibiao [1 ,2 ]
机构：
[1] Chinese Acad Sci, Inst Elect Engn, Beijing, Peoples R China
[2] Chinese Acad Sci, Key Lab Power Elect & Elect Drive, Inst Elect Engn, Beijing, Peoples R China
来源：
2021 3RD ASIA ENERGY AND ELECTRICAL ENGINEERING SYMPOSIUM (AEEES 2021) | 2021年
基金：
国家重点研发计划;
关键词：
printed circuit boards; layout optimization; thermal analysis; Taguchi method;
D O I：
10.1109/AEEES51875.2021.9403195
中图分类号：
TE [石油、天然气工业]; TK [能源与动力工程];
学科分类号：
0807 ; 0820 ;
摘要：
The power density of power electronics systems and the temperature of components on Printed circuit boards (PCB) are increasing higher and higher with the rapid development of power electronic technology, and optimizing the layout of PCB based on thermal analysis is becoming more and more important. A thermal simulating model of PCB in a self-developed controller for electric vehicles was built and the layout of components on PCB was optimized using Taguchi Method in this paper. The optimization process was carried out and the locally optimal solution was analyzed and verified by the simulation.
引用
收藏
页码：198 / 202
页数：5
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