共 50 条
- [2] EMC design tips: Positioning multiple decoupling capacitors in printed circuit boards [J]. 1600, Institute of Electrical and Electronics Engineers Inc. (02):
- [3] Multi-pin Optimization of Decoupling Capacitors on Practical Printed Circuit Boards [J]. 2018 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM (EDAPS 2018), 2018,
- [4] Decoupling strategies for printed circuit boards without power planes [J]. 2002 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY, VOLS 1 AND 2, SYMPOSIUM RECORD, 2002, : 258 - 261
- [7] Embedded capacitors technology in printed circuit boards [J]. 2007 INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE, PROCEEDINGS OF TECHNICAL PAPERS, 2007, : 127 - 130
- [8] Estimating the power bus impedance of printed circuit boards with embedded capacitance [J]. IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2002, 25 (03): : 424 - 432
- [9] Analysis of power/ground noises and decoupling capacitors in printed circuit board systems [J]. IEEE 1997 INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY - SYMPOSIUM RECORD, 1997, : 425 - 430
- [10] Optimum placement of decoupling capacitors on packages and printed circuit boards under the guidance of electromagnetic field simulation [J]. 46TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1996 PROCEEDINGS, 1996, : 756 - 760