A rapid cure epoxy resin system for a RTM process

被引:0
|
作者
Kamae, T. [1 ]
Tanaka, G. [2 ]
Oosedo, H. [3 ]
机构
[1] Michigan State Univ, Composite Mat & Struct Ctr, 3155 Engn Bldg, E Lansing, MI 48824 USA
[2] Toray Industries Ltd, Adv Composites Dev Ctr, Iyogun, Ehime 7913193, Japan
[3] Toray Industries Ltd, New Frontiers Res Lab, Kamakura, Kanagawa 2488555, Japan
关键词
D O I
暂无
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
A new epoxy resin system for a RTM process has been developed to improve the production rate of carbon fiber reinforced plastics (CFRPs). The resin system, composed of an anionic polymerized epoxy resin with a chain transfer agent exhibits both longer flow time for impregnation and shorter cure time. The cured resin has good mechanical properties, such as high tensile modulus (3.8GPa), tensile strength (79MPa) and fracture tensile strain (4.1%). With the resin system, a flat CFRP panel (35cm x 70cm x 2mm (thickness) and fiber volume fraction of 52%) was successfully fabricated in 8 minutes by an isothermal RTM process at 105 square. Mechanical tests of the CFRP panel result in high tensile strength (650MPa) and compression strength (620MPa). Also, the CFRP panel has a high T-g (116 square). These results demonstrate that the resin system is practical for automobile outer panel production.
引用
收藏
页码:390 / +
页数:2
相关论文
共 50 条
  • [41] Cure kinetics and rheology characterization of soy-based epoxy resin system
    Liang, G.
    Chandrashekhara, K.
    JOURNAL OF APPLIED POLYMER SCIENCE, 2006, 102 (04) : 3168 - 3180
  • [42] Cure reaction of CE-40 cyanate ester/epoxy resin system
    Hong, X. (hongxuhui2003@163.com), 2012, Chengdu University of Science and Technology (28):
  • [43] The development of a low temperature cure modified epoxy resin system for aerospace composites
    Carter, JT
    Emmerson, GT
    Lo Faro, C
    McGrail, PT
    Moore, DR
    COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING, 2003, 34 (01) : 83 - 91
  • [44] Cure Shrinkage Characterization of an Epoxy Resin System by Two in Situ Measurement Methods
    Khoun, Lolei
    Hubert, Pascal
    POLYMER COMPOSITES, 2010, 31 (09) : 1603 - 1610
  • [45] Cure kinetics of an epoxy-anhydride-imidazole resin system by isothermal DSC
    Wang, C. S.
    Kwag, Choongyong
    POLYMERS & POLYMER COMPOSITES, 2006, 14 (05): : 445 - 454
  • [46] Study on the cure kinetics of middle temperature curing 3234 epoxy resin system
    Liu, TS
    Chen, XB
    Zhang, BY
    PRICM 5: THE FIFTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, PTS 1-5, 2005, 475-479 : 1041 - 1044
  • [47] EFFECT OF KINETIC AND THERMAL PARAMETERS ON THE PROCESS OF CURE OF EPOXY-RESIN IN A CYLINDRICAL MOLD
    CHATER, M
    VERGNAUD, JM
    EUROPEAN POLYMER JOURNAL, 1987, 23 (07) : 563 - 569
  • [48] Reactive Blends of Epoxy Resin (DGEBA) Crosslinked by Anionically Polymerized Polycaprolactam: Process of Epoxy Cure and Kinetics of Decomposition
    Gupta, Alka
    Singhal, Reena
    Nagpal, A.K.
    Journal of Applied Polymer Science, 2004, 92 (02): : 687 - 697
  • [49] Cure kinetics and rheology characterization of soy-based epoxy resin system
    Liang, G.
    Chandrashekhara, K.
    Journal of Applied Polymer Science, 2006, 102 (04): : 3168 - 3180
  • [50] The use of low resolution NMR to monitor the extent of cure in an epoxy resin system
    Newbury, AL
    Lowry, RB
    Short, D
    ADVANCED COMPOSITES LETTERS, 1995, 4 (06) : 189 - 193