Diamond composites of high thermal conductivity and low dielectric loss tangent

被引：8

作者：

Osipov, A. S. ^{[1
]}

Klimczyk, P. ^{[2
]}

Rutkowski, P. ^{[3
]}

Melniychuk, Y. A. ^{[1
]}

Romanko, L. O. ^{[1
]}

Podsiadlo, M. ^{[2
]}

Petrusha, I. A. ^{[1
]}

Jaworska, L. ^{[3
]}

机构：

[1] Natl Acad Sci Ukraine, Inst Superhard Mat, 2 Avtozavodskya St, UA-04074 Kiev, Ukraine

[2] Krakow Inst Technol, Lukasiewicz Res Network, Zakopianska 73, PL-30418 Krakow, Poland

[3] AGH Univ Sci & Technol, 30 Al Mickiewicza, PL-30059 Krakow, Poland

来源：

MATERIALS SCIENCE AND ENGINEERING B-ADVANCED FUNCTIONAL SOLID-STATE MATERIALS | 2021年 / 269卷

关键词：

Diamond composite; High pressure; Thermal conductivity; Dielectric constant; Dielectric loss tangent; CVD DIAMOND; PRESSURE;

D O I：

10.1016/j.mseb.2021.115171

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Diamond-CaMg(CO3)(2) and diamond-CaCO3 compacts were produced. Maximum values of high thermal conductivity of 540 W/m K, electrical resistivity of 2.10(11) ohm cm, dielectric constant of 47, and dielectric loss tangent of 5.8.10(-3) at 106 Hz were achieved. The composites based on diamonds were sintered at a high pressure of 8.0 GPa and temperature of 2100 degrees C and were characterised by high ratios of direct bonding between the diamond grains. Diamond grain size varied from 12 to 45 mu m. The CaCO3 content of the diamond-CaCO3 composites and the CaMg(CO3)(2) content of the diamond-CaMg(CO3) (2) composites were 8.5 vol% and 8.8 vol%, respectively. The materials developed are recommended for use as heat sinks in a wide range of electronic devices.

引用

页数：5

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