Fluxless Sn-Ag solder ball formation for flip-chip application

被引：0
|
作者：
Flachsbart, B [1 ]
Hsieh, KC [1 ]
机构：
[1] UNIV ILLINOIS,DEPT ELECT & COMP ENGN,CTR COMPOUND SEMICOND MICROELECTR,URBANA,IL 61801
来源：
OPTOELECTRONIC PACKAGING | 1996年 / 2691卷
关键词：
flip-chip bonding; solder ball formation; passive alignment; fluxless solder; lead-free solder;
D O I：
10.1117/12.236926
中图分类号：
O43 [光学];
学科分类号：
070207 ; 0803 ;
摘要：
引用
收藏
页码：54 / 60
页数：7
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