Hot-carrier reliability of ultra-thin gate oxide CMOS

被引:2
|
作者
Momose, HS
Nakamura, S
Ohguro, T
Yoshitomi, T
Morifuji, E
Morimoto, T
Katsumata, Y
Iwai, H
机构
[1] Toshiba Corp, Isogo Ku, Yokohama, Kanagawa 2358522, Japan
[2] Tokyo Inst Technol, Midori Ku, Yokohama, Kanagawa 2268502, Japan
关键词
D O I
10.1016/S0038-1101(00)00101-5
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Hot-carrier degradation on electrical characteristics of MOSFETs in the direct-tunneling regime of the gate oxide was investigated under a wide range of conditions, namely stress bias, oxide thickness, gate length, and channel-type dependence. It was confirmed that the transconductance degradation of n-MOSFETs with thinner gate oxides is smaller than that of thicker gate oxide MOSFETs, in spite of larger gate direct-tunneling leakage current and larger hot-carrier generation. For p-MOSFETs, little degradation was observed under all conditions of stress bias, oxide thickness, and gate length. (C) 2000 Elsevier Science Ltd. All rights reserved.
引用
收藏
页码:2035 / 2044
页数:10
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