Enhanced semi-empirical potentials in molecular dynamics simulations of wafer bonding

被引:4
|
作者
Scheerschmidt, K [1 ]
Conrad, D [1 ]
Belov, A [1 ]
Timpel, D [1 ]
机构
[1] Max Planck Inst Microstruct Phys, D-06120 Halle, Germany
关键词
empirical molecular dynamics; wafer bonding; bonded interfaces; tight-binding potentials; bond order approximation; dislocation interaction;
D O I
10.1016/S1369-8001(00)00020-2
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Molecular dynamics simulations using suitably fitted empirical potentials have been employed to describe atomic interactions at interfaces created by the macroscopic wafer bonding process. Investigating perfect or distorted surfaces (steps, reconstruction, adsorbates, facets, mistilt, twist rotation) of different semiconductor materials as well as of silica enables one to study the elementary processes and the resulting defects at the interfaces as well as to characterize the ability of the potentials used. Preliminary simulations on the basis of empirical potentials developed by the bond order tight-binding approximation, yield enhanced interface structures and energetic relaxations as well as transferability to new materials systems. (C) 2000 Elsevier Science Ltd. All rights reserved.
引用
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页码:129 / 135
页数:7
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