Mass production of high thermal conductive boron nitride/nanofibrillated cellulose composite membranes

被引:71
|
作者
Li, Qingye [1 ]
Xue, Zhouhang [1 ]
Zhao, Jiangqi [1 ]
Ao, Chenghong [1 ]
Jia, Xiwen [1 ]
Xia, Tian [1 ]
Wang, Qunhao [1 ]
Deng, Xueyong [1 ]
Zhang, Wei [1 ,2 ]
Lu, Canhui [1 ,2 ]
机构
[1] Sichuan Univ, State Key Lab Polymer Mat Engn, Polymer Res Inst, Chengdu 610065, Sichuan, Peoples R China
[2] Sichuan Univ, Adv Polymer Mat Res Ctr, Shishi 362700, Peoples R China
基金
中国国家自然科学基金;
关键词
Boron nitride nanoplatets; Nanofibrillated cellulose; Exfoliation; Scalable production; Thermal conductivity; POLYMER-BASED COMPOSITES; NITRIDE NANOSHEETS; NANOFIBRILLATED CELLULOSE; SIGNIFICANT ENHANCEMENT; EFFECTIVE REMOVAL; FILMS; GRAPHENE; NANOCOMPOSITE; FIBERS; SIZE;
D O I
10.1016/j.cej.2019.123101
中图分类号
X [环境科学、安全科学];
学科分类号
08 ; 0830 ;
摘要
Boron nitride nanoplates (BNNPs) are highly desirable in thermal management applications. To achieve better performance, boron nitride (BN) has to be extensively exfoliated and dispersed in liquids. However, most of current techniques suffer from being high in cost, time consuming, and environmentally unfriendly, which limits the mass production of BNNPs for a wide range of applications. Herein, we demonstrate a simple yet green manufacturing process for efficient exfoliation and dispersion of BN and bamboo cellulose via stress-induced simultaneous exfoliation/dispersion (SISED) in an aqueous medium. This method can produce well exfoliated BNNPs/ nanofibrillated cellulose (NFC) with the average BNNPs thickness of 51 nm and NFC diameter of 43 nm after only 1.98 h treatment. Thanks to the excellent dispersion, heat-conducting and electric-insulating BNNPs/ NFC nanocomposite membranes with an BNNPs content of 40 wt% are fabricated through vacuum-assisted filtration. The micro-structures of the membranes as well as their mechanical and thermal properties can be tailored by changing the refining time and the pan gap to meet different needs. The resultant membranes exhibit high mechanical properties with a tensile strength of 74.6 MPa and excellent thermal conductivity of 20.64Wm(-1) K-1, suggesting their great potential in fabricating next-generation portable electronics.
引用
收藏
页数:9
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