A Study of FinFET Device Optimization and PPA Analysis at 5 nm Node

被引:0
|
作者
Luo, Xin [1 ]
Ding, Yu [1 ]
Shang, Enming [1 ]
Sun, Jie [1 ]
Hu, Shaojian [1 ]
Chen, Shoumian [1 ]
Zhao, Yuhang [1 ]
机构
[1] Shanghai IC R&D Ctr, 497 Gaosi Rd,Zhangjiang Hitech Pk, Shanghai, Peoples R China
来源
2020 CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2020 (CSTIC 2020) | 2020年
关键词
5; nm; FinFET; device; TCAD; PPA; ring oscillator;
D O I
10.1109/cstic49141.2020.9282502
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
Since the logic 5 nm node still uses FinFET device, it still has room for device performance improvement since its first debut in the production of 16 nm node. The goal of this paper is to investigate the FinFET device optimization and Power Performance Area (PPA) at the 5 nm node. We have simulated FinFET device electrical characteristics at Front-End-Of-the-Line (FEOL) with Technology Computer Aided Design (TCAD). We first focus on the device with different spacer thicknesses to investigate DC and AC characteristics. Then we focus on the power and speed performance of Ring Oscillator (RO) circuits based on 5 nm NMOS and PMOS devices. Detailed study has been carried out to analyze the influence of Number of fins (Nfin), Back-End-Of-the-Line (BEOL) interconnect length, and fan-out number to power and speed. We hope that our results can assist other researchers in better understanding of the 5 nm FinFET device performance.
引用
收藏
页数:4
相关论文
共 50 条
  • [21] Design and Performance Optimization of Junctionless Bottom Spacer FinFET for Digital/Analog/RF Applications at Sub-5nm Technology Node
    Valasa, Sresta
    Ramakrishna, K. V.
    Vadthiya, Narendar
    Bhukya, Sunitha
    Rao, N. Bheema
    Maheshwaram, Satish
    ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 2023, 12 (01)
  • [22] Etch Mechanism Study in Gate Patterning for 14 nm Node and beyond FinFET Devices
    Meng, Lingkuan
    Yan, Jiang
    ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 2017, 6 (01) : Q23 - Q28
  • [23] Embedded SRAM Designs for Enhancing Performance, Power and Area (PPA) in 16 nm FinFET Technology
    Nii, Koji
    Ishii, Yuichiro
    Yabuuchi, Makoto
    Sano, Toshiaki
    Morimoto, Masao
    Sawada, Yohei
    Tsukamoto, Yasumasa
    Tanaka, Miki
    Tanaka, Shinji
    2016 13TH IEEE INTERNATIONAL CONFERENCE ON SOLID-STATE AND INTEGRATED CIRCUIT TECHNOLOGY (ICSICT), 2016, : 563 - 566
  • [24] Scaling beyond the 65 nm node with FinFET-DGCMOS
    Nowak, EJ
    Ludwig, T
    Aller, I
    Kedzierski, J
    Ieong, M
    Rainey, B
    Breitwisch, M
    Gernhoefer, V
    Keinert, J
    Fried, DM
    PROCEEDINGS OF THE IEEE 2003 CUSTOM INTEGRATED CIRCUITS CONFERENCE, 2003, : 339 - 342
  • [25] CMOS Scaling for the 5 nm Node and Beyond: Device, Process and Technology
    Radamson, Henry H.
    Miao, Yuanhao
    Zhou, Ziwei
    Wu, Zhenhua
    Kong, Zhenzhen
    Gao, Jianfeng
    Yang, Hong
    Ren, Yuhui
    Zhang, Yongkui
    Shi, Jiangliu
    Xiang, Jinjuan
    Cui, Hushan
    Lu, Bin
    Li, Junjie
    Liu, Jinbiao
    Lin, Hongxiao
    Xu, Haoqing
    Li, Mengfan
    Cao, Jiaji
    He, Chuangqi
    Duan, Xiangyan
    Zhao, Xuewei
    Su, Jiale
    Du, Yong
    Yu, Jiahan
    Wu, Yuanyuan
    Jiang, Miao
    Liang, Di
    Li, Ben
    Dong, Yan
    Wang, Guilei
    NANOMATERIALS, 2024, 14 (10)
  • [26] Sensitivity Study and Parameter Optimization of OCD Tool for 14 nm FinFET Process
    Zhang, Zhensheng
    Chen, Huiping
    Cheng, Shiqiu
    Zhan, Yunkun
    Huang, Kun
    Shi, Yaoming
    Xu, Yiping
    METROLOGY, INSPECTION, AND PROCESS CONTROL FOR MICROLITHOGRAPHY XXX, 2016, 9778
  • [27] A Simulation Study of NBTI Impact on 14-nm Node FinFET Technology for Logic Applications: Device Degradation to Circuit-Level Interaction
    Mishra, Subrat
    Amrouch, Hussam
    Joe, Jerin
    Dabhi, Chetan K.
    Thakor, Karansingh
    Chauhan, Yogesh S.
    Henkel, Joerg
    Mahapatra, Souvik
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2019, 66 (01) : 271 - 278
  • [28] Design and Optimization of ESD Lateral NPN Device in 14nm FinFET SOI CMOS Technology
    Li, You
    Mishra, Rahul
    Song, Liyang
    Gauthier, Robert
    2015 37TH ELECTRICAL OVERSTRESS/ELECTROSTATIC DISCHARGE SYMPOSIUM (EOS/ESD), 2015,
  • [29] Effects of Collected Charge and Drain Area on SE Response of SRAMs at the 5-nm FinFET Node
    Pieper, N. J.
    Xiong, Y.
    Ball, D. R.
    Pasternak, J.
    Bhuva, B. L.
    2023 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM, IRPS, 2023,
  • [30] Ge-cap quantum-well bulk FinFET for 5 nm node CMOS integration
    Kurniawan, Erry Dwi
    Peng, Kang-Hui
    Yang, Shang-Yi
    Yang, Yi-Yun
    Thirunavukkarasu, Vasanthan
    Lin, Yu-Hsien
    Wu, Yung-Chun
    JAPANESE JOURNAL OF APPLIED PHYSICS, 2018, 57 (04)