Multilayer thick-film technology as applied to design of microwave devices

被引：2
|
作者：
Kapitanova, Polina V. [1 ]
Simine, Alexander V. [2 ]
Kholodnyak, Dmitry V. [1 ]
Vendik, Irina B. [1 ]
机构：
[1] St Petersburg Electrotech Univ, Dept Microelect & Radio Engn, St Petersburg 197376, Russia
[2] Innovat Ctr RF NXP Semicond, NL-6434 AE Nijmegen, Netherlands
来源：
JOURNAL OF THE EUROPEAN CERAMIC SOCIETY | 2007年 / 27卷 / 8-9期
关键词：
microwave integrated circuits (MICs);
D O I：
10.1016/j.jeurceramsoc.2006.11.019
中图分类号：
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
Possibilities of the sandwich multilayer technology to design microwave integrated circuits are discussed. Original designs of various passive microwave devices realized as multilayer sandwich structures are presented. Experimental results confirmed a good potential of the sandwich technology to design high-performance multilayer microwave integrated circuits. (c) 2006 Elsevier Ltd. All rights reserved.
引用
收藏
页码：2941 / 2944
页数：4
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