Pulsed THz Imaging for Non-Destructive Testing of Adhesive Bonds

被引:0
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作者
Schmidhammer, U. [1 ]
Jeunesse, P. [1 ]
机构
[1] Univ Paris 11, CNRS, UMR 8000, Chim Phys Lab,ELYSE, F-91405 Orsay, France
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TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
We demonstrate imaging with a single-shot THz Time Domain spectrometer for the rapid, but precise location and characterization of defects in an adhesive bond.
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页数:2
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