The influence of the chip-scale-package on the functioning and reliability of RF-MEMS switches

被引：0
|
作者：
Song Ming-Xin [1 ]
Zhu Min [1 ]
He Xun-Jun [1 ]
Yin Jing-Hua [1 ]
机构：
[1] Harbin Univ Sci & Technol, Sch Appl Sci, Harbin 150080, Peoples R China
来源：
ICEPT: 2006 7TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS | 2006年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper discusses the influence of materials and structures inside a package on the functioning and reliability of chip-scale-package RF-MEMS switches. It is shown that materials and structures strongly influence electrical performance characteristics such as the switching insertion loss of switches. By computer simulation design for a RF MEMS switches and its package, a model is built with choiceness performance characteristics. Especially, the pull-up electrode can increase reliability of the device, which has extremely low insertion loss of -0.8 dB and a high isolation of -33 dB up to 20 GHz. The packaging process can be applied to process wafer of RF MEMS switching devices. This work will help designers of RF-MEMS switches remove redundant features optimize structures in MEMS component packages to get maximize performance and help drive cost down.
引用
收藏
页码：626 / +
页数：2
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