Effect of SiC Nanoparticles Dispersion on the Microstructure and Mechanical Properties of Electroplated Sn-Bi Solder Alloy

The effect of SIC nanoparticle dispersion was investigated for microstructure change and mechanical properties of Sn-Bi electroplated alloys. The diameters of SIC nanoparticle in this study were 45-55 nm. The SIC nanoparticles were mixed with Sn-Bi electroplating and then the nanoparticles were dispersed with ultrasonic vibrator. After the dispersion, the SiC dispersed Sn-Bi alloys were electroplated on Cu deposited Si wafer. The microstructure and mechanical properties of the sample were evaluated by FE-TEM, FE-SEM, EDS, and shear tester. For TEM observation, the specimens were prepared by ultramicrotome and FIB. The SiC nanoparticles were well-dispersed in Sn-Bi alloy. SIC particles were located near grain boundaries or grain inside. The average grain size of the solder alloy was decrease about 30% compared with the grain size of Sn-Bi alloy prepared in the same condition. Due to the grain refinement and dispersion hardening by SIC nanoparticles, the SiC dispersed Sn-Bi alloy is expected to obtain high reliability and joining strength when it applied to interconnection materials.