Advances in high throughput wafer and solar cell technology for EFG ribbon

被引：5

作者：

Kalejs, J ^{[1
]}

Mackintosh, B ^{[1
]}

Schmidt, W ^{[1
]}

Woesten, B ^{[1
]}

机构：

[1] ASE Amer Inc, Billerica, MA 01821 USA

来源：

CONFERENCE RECORD OF THE TWENTY-NINTH IEEE PHOTOVOLTAIC SPECIALISTS CONFERENCE 2002 | 2002年

关键词：

D O I：

10.1109/PVSC.2002.1190459

中图分类号：

TE [石油、天然气工业]; TK [能源与动力工程];

学科分类号：

0807 ; 0820 ;

摘要：

Construction of as many as 70 x 100 MW manufacturing facilities in the next two decades is required to address U.S. Photovoltaic Industry Roadmap targets. Effective material utilization, high throughput and yield, improvements in solar cell efficiency, and minimizing the environmental impact of manufacturing waste products are all desirable attributes that must be combined in low cost factory equipment. We discuss how these elements are being addressed with ribbon technology now under development for crystalline silicon wafer production by the Edge-defined Film-fed Growth (EFG) method.

引用

页码：74 / 77

页数：4

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