Impact of Equivalent Oxide Thickness on Threshold Voltage Variation Induced by Work-Function Variation in Multigate Devices

被引:30
|
作者
Lee, Youngtaek [1 ,2 ]
Shin, Changhwan [2 ]
机构
[1] SK Hynix, Icheon 17336, South Korea
[2] Univ Seoul, Dept Elect & Comp Engn, Seoul 02504, South Korea
基金
新加坡国家研究基金会;
关键词
Characterization; equivalent oxide thickness (EOT); FinFET; gate-all-around (GAA); ratio of average grain size to gate area (RGG); work-function variation (WFV); METAL-GATE TRANSISTORS; FINFET;
D O I
10.1109/TED.2017.2673859
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Using 3-D technology computer aided design simulation, we investigated the impact of equivalent oxide thickness (EOT) on threshold voltage (V-TH) variation induced by work-function variation (WFV) in multigate devices. The WFV-induced VTH variation in multigate devices does not significantly vary with the dielectric constant of the gate dielectric material, but increases with decreasingphysicaloxide thickness(T-OX). As T-OX becomes thinner, electric field tends to be locally concentrated, causing a large variation of electrostatic potential in channel. The slope of the ratio of average grain size to gate area (RGG) plot is observed with various oxide thicknesses. It is confirmed that we can alleviate the WFV-induced VTH variation without significant performance degradation if gate dielectric layer becomes thicker with appropriately adopted higher-k engineering. In addition, the impact of EOT (including interface layer) on the WFV-induced VTH variation is studied.
引用
收藏
页码:2452 / 2456
页数:5
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