Three-dimensional cellular automata for simulation of microstructure evolution during recrystallization

被引:0
|
作者
Svyetlichnyy, Dmytro S. [1 ]
Matachowski, Jaroslaw L. [2 ]
机构
[1] AGH Univ Technol & Sci, Fac Met Engn & Ind Comp Sci, Mickiewicza 30, PL-30059 Krakow, Poland
[2] Czestochowa Tech Univ, Fac Mat Proc Technol & Appl Phys, PL-42200 Czestochowa, Poland
关键词
D O I
暂无
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
A cellular automation method is one of calculation methods, which allows for modeling of complex joint phenomena that take place in material during and after the deformation in the meso- and micro-scale. The phenomena, which can be taken into consideration with high precision, are processes connected with microstructure evolution. For modeling by cellular automata (CA) are mainly used two-dimensional ones, because of more expensive calculations by three-dimensional CA. But three-dimensional phenomena cannot be generally reduced to two-dimensional solution. In the paper a description of a modified three-dimensional CA is presented. The model of microstructure contains three parts: deformation of grains, recrystallization and grains growth after recrystallization. Recrystallization is considered as a process without division on the different kinds (dynamic, metadynamic or static). It consists of two stages: nucleation and new grains growth. Nucleation rate and grain growth rate are dependent on parameters of deformation. In the model such parameters as temperature, strain, strain rate, dislocation density, crystallographic orientation and some others are taken into account. Along with calculation of microstructure evolution, model allows for prediction of mechanical properties, for example flow stress. A flow stress calculations reckon processes of hardening and softening using model of the dislocation density development in consideration with an effect of the recrystallization. Some results of simulations based on 3D cellular automaton are presented in the paper.
引用
收藏
页码:1357 / +
页数:2
相关论文
共 50 条
  • [21] Review on modeling and simulation of microstructure evolution during dynamic recrystallization using cellular automaton method
    ZHU HuaJia
    CHEN Fei
    ZHANG HaiMing
    CUI ZhenShan
    Science China(Technological Sciences), 2020, 63 (03) : 357 - 396
  • [22] Review on modeling and simulation of microstructure evolution during dynamic recrystallization using cellular automaton method
    ZHU HuaJia
    CHEN Fei
    ZHANG HaiMing
    CUI ZhenShan
    Science China(Technological Sciences), 2020, (03) : 357 - 396
  • [23] Three-dimensional modeling of the microstructure evolution during metal additive manufacturing
    Zinovieva, O.
    Zinoviev, A.
    Ploshikhin, V.
    COMPUTATIONAL MATERIALS SCIENCE, 2018, 141 : 207 - 220
  • [24] Evolution of microstructure during the shape rolling modeled by cellular automata
    Lach, Lukasz
    Svyetlichnyy, Dmytro S.
    MATERIAL FORMING - ESAFORM 2012, PTS 1 & 2, 2012, 504-506 : 187 - 192
  • [25] Three-Dimensional Cellular Automata Simulation of the Austenitizing Process in GCr15 Bearing Steel
    Su, Fuyong
    Liu, Wenli
    Wen, Zhi
    MATERIALS, 2019, 12 (18)
  • [26] Virtual Reality Tool for Exploration of Three-Dimensional Cellular Automata
    Arevalo, Camilo
    Kariyado, Yuta
    Villegas, Julian
    ELECTRONICS, 2022, 11 (03)
  • [27] Three-dimensional simulation of microstructure evolution in damascene interconnects: Effect of overburden thickness
    Jung, JK
    Hwang, NM
    Park, YJ
    Joo, YC
    JOURNAL OF ELECTRONIC MATERIALS, 2005, 34 (05) : 559 - 563
  • [28] Three-dimensional cellular automata for reaction-diffusion systems
    Weimar, JR
    FUNDAMENTA INFORMATICAE, 2002, 52 (1-3) : 277 - 284
  • [29] Three-dimensional simulation of microstructure evolution in damascene interconnects: Effect of overburden thickness
    Jung-Kyu Jung
    Nong-Moon Hwang
    Young-Joon Park
    Young-Chang Joo
    Journal of Electronic Materials, 2005, 34 : 559 - 563
  • [30] Three-dimensional cellular automaton simulation of coupled hydrogen porosity and microstructure during solidification of ternary aluminum alloys
    Gu, Cheng
    Lu, Yan
    Ridgeway, Colin D.
    Cinkilic, Emre
    Luo, Alan A.
    SCIENTIFIC REPORTS, 2019, 9 (1)