Nanoscale corrosion behavior of polycrystalline copper fine wires in dilute NaCl solution investigated by in-situ atomic force microscopy

被引：14
|
作者：
Ogata, Shoichiro [1 ,2 ]
Kobayashi, Naritaka [1 ,3 ]
Kitagawa, Takuya [1 ]
Shima, Shohei [2 ]
Fukunaga, Akira [2 ]
Takatoh, Chikako [2 ]
Fukuma, Takeshi [1 ]
机构：
[1] Kanazawa Univ, Div Elect Engn & Comp Sci, Kanazawa, Ishikawa 9201192, Japan
[2] EBARA Corp, Tokyo 1448510, Japan
[3] Saitama Univ, Div Strateg Res & Dev, Saitama 3388570, Japan
来源：
CORROSION SCIENCE | 2016年 / 105卷
关键词：
Copper; AFM; Anodic dissolution; SCANNING ELECTROCHEMICAL MICROSCOPY; ANODIC-OXIDATION; DEFLECTION SENSOR; INITIAL-STAGES; CU(111); FILMS; STM; ORIENTATION; CU(001); SURFACE;
D O I：
10.1016/j.corsci.2016.01.015
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
In this study, nanoscale corrosion behavior of copper fine wires in dilute NaCl solution is studied by atomic force microscopy and electron backscatter diffraction. The dissolution rate of grains constituting the wires strongly depends on their crystallographic orientation. In pure water, the dissolution rate increases in the order of (111) < (001) < (110). Addition of Cl- dramatically increases the dissolution rate of the (111) surface to alter the order to (110) approximate to (001) approximate to (111) at 0.1 mM. These results show that the crystallographic orientation dependence is significantly changed by a slight increase of Cl- concentration in dilute solution. (C) 2016 Elsevier Ltd. All rights reserved.
引用
收藏
页码：177 / 182
页数：6
相关论文
共 41 条
12345