Effect of Plastic Deformation on the Proof Strength and Electrical Conductivity of Copper-Magnesium Supersaturated Solid-Solution Alloys

被引：14

作者：

Ito, Yuki ^{[1
]}

Matsunaga, Hirotaka ^{[1
]}

Mori, Hiroyuki ^{[1
]}

Maki, Kazunari ^{[1
]}

机构：

[1] Mitsubishi Mat Corp, Cent Res Inst, Kitamoto 3640022, Japan

来源：

MATERIALS TRANSACTIONS | 2014年 / 55卷 / 11期

关键词：

copper alloys; electrical resistivity/conductivity; proof strength; supersaturated solid solution alloys; CU-AL ALLOYS; MECHANICAL-PROPERTIES; ENERGY;

D O I：

10.2320/matertrans.M2014220

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The influences of plastic deformation on the proof strength and electrical conductivity of Copper-Magnesium (Cu-Mg) supersaturated solid-solution alloys are investigated and compared to results obtained for pure copper and conventional binary solid-solution copper alloys. Supersaturated Cu-Mg required cold rolling to only a quarter of the equivalent strain (epsilon = 0.65) of conventional alloys (epsilon = 2.66) to obtain the same proof strength and electrical conductivity. Furthermore, when cold-rolled to epsilon = 2.66, Cu-Mg exhibited an electrical conductivity 2.5 times higher than that of conventional alloys, while retaining comparable proof strength.

引用

页码：1738 / 1741

页数：4

共 36 条

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