InP HBT Amplifier MMICs Operating to 0.67 THz

被引:13
|
作者
Hacker, Jonathan [1 ]
Urteaga, Miguel [1 ]
Seo, Munkyo [1 ]
Skalare, Anders [2 ]
Lin, Robert [2 ]
机构
[1] Teledyne Sci Co, Thousand Oaks, CA 91360 USA
[2] CALTECH, Jet Prop Lab, Pasadena, CA 91109 USA
关键词
Submillimeter-wave; terahertz; TMIC; indium phosphide (InP) DHBT bipolar transistor;
D O I
10.1109/MWSYM.2013.6697518
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Two indium-phosphide (InP) double-heterojunction bipolar transistor (DHBT) based terahertz monolithic integrated circuit (TMIC) amplifiers are reported with record operating bandwidths up to 694 GHz. The first amplifier uses 3 mu m long emitter transistors, has 24 dB gain at 670 GHz, and a saturated output power of -4 dBm at 585 GHz. The second amplifier uses 6 mu m long emitter transistors, has 20 dB gain at 655 GHz, and a saturated output power of -0.7 dBm at 585 GHz. Both TMICs use Teledyne's 130nm InP DHBT transistors in a common base configuration and are matched using inverted CPW transmission lines realized using a three-metal-layer high-density thin-film interconnects system. These results demonstrate the capability of 130nm InP DHBT technology to enable sophisticated TMIC circuits for operation in the terahertz band.
引用
收藏
页数:3
相关论文
共 50 条
  • [21] An InGaAs/InP HBT differential transimpeclance amplifier with 47 GHz bandwidth
    Weiner, JS
    Lee, JS
    Leven, A
    Baeyens, Y
    Houtsma, V
    Georgiou, G
    Yang, Y
    Frackoviak, J
    Tate, A
    Reyes, R
    Kopf, RF
    Sung, WJ
    Weimann, NG
    Chen, YK
    GAAS IC SYMPOSIUM - 25TH ANNUAL TECHNICAL DIGEST 2003, 2003, : 245 - 248
  • [22] Low Noise Amplification at 0.67 THz Using 30 nm InP HEMTs
    Deal, William. R.
    Leong, K.
    Radisic, V.
    Sarkozy, S.
    Gorospe, B.
    Lee, J.
    Liu, P. H.
    Yoshida, W.
    Zhou, J.
    Lange, M.
    Lai, R.
    Mei, X. B.
    IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, 2011, 21 (07) : 368 - 370
  • [23] InP/InGaAs-DHBT distributed amplifier MMICs exceeding 80 GHz bandwidth
    Schneider, K
    Driad, R
    Makon, RE
    Tessmann, A
    Aidam, R
    Quay, R
    Schlechtweg, M
    Weimann, G
    2005 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM, VOLS 1-4, 2005, : 1591 - 1593
  • [24] 50 to 70 GHz InP/InGaAs HBT amplifier with 20 dB gain
    Morf, Thomas
    Huber, Dieter
    Huber, Alex
    Schwarz, Volker
    Jackel, Heinz
    Conference Proceedings - International Conference on Indium Phosphide and Related Materials, 1999, : 431 - 435
  • [25] A 182 GHz Triple-Stacked Distributed Amplifier in InP HBT Process
    Cui, Can
    Nguyen, Phat T.
    Nguyen, Nguyen L. K.
    Killeen, Natalie
    Kelley, Tyler
    Stameroff, Alexander
    Anh-Vu Pham
    2023 18TH EUROPEAN MICROWAVE INTEGRATED CIRCUITS CONFERENCE, EUMIC, 2023, : 137 - 140
  • [26] Design and fabrication of wideband transimpedance amplifier by using InGaAs/InP HBT technology
    Lee, JM
    Kim, SI
    Min, BG
    Ju, CW
    Lee, KH
    JOURNAL OF THE KOREAN PHYSICAL SOCIETY, 2004, 45 : S906 - S908
  • [27] A 180mW InP HBT Power Amplifier MMIC at 214 GHz
    Reed, Thomas B.
    Griffith, Zach
    Rowell, Petra
    Field, Mark
    Rodwell, Mark
    2013 IEEE COMPOUND SEMICONDUCTOR INTEGRATED CIRCUIT SYMPOSIUM (CSICS): INTEGRATED CIRCUITS IN GAAS, INP, SIGE, GAN AND OTHER COMPOUND SEMICONDUCTORS, 2013,
  • [28] A gain boosted single stage wideband InP HBT amplifier for terahertz applications
    Abbas, Waseem
    Seo, Munkyo
    PROCEEDINGS OF THE 2022 16TH INTERNATIONAL CONFERENCE ON UBIQUITOUS INFORMATION MANAGEMENT AND COMMUNICATION (IMCOM 2022), 2022,
  • [29] THz InP HEMT和HBT技术的最新研究进展
    王淑华
    微纳电子技术, 2018, 55 (06) : 381 - 387+421
  • [30] InP HBT IC Technology for Terahertz Frequencies: Fundamental Oscillators Up to 0.57 THz
    Seo, Munkyo
    Urteaga, Miguel
    Hacker, Jonathan
    Young, Adam
    Griffith, Zach
    Jain, Vibhor
    Pierson, Richard
    Rowell, Petra
    Skalare, Anders
    Peralta, Alejandro
    Lin, Robert
    Pukala, David
    Rodwell, Mark
    IEEE JOURNAL OF SOLID-STATE CIRCUITS, 2011, 46 (10) : 2203 - 2214