共 50 条
- [23] Thermo-mechanical simulation of plastic deformation during temperature cycling of bond wires for power electronic modules 2014 15TH INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME), 2014,
- [25] Wire bond failures in power modules ELECTRONIC AND PHOTONIC PACKAGING, ELECTRICAL SYSTEMS AND PHOTONIC DESIGN AND NANOTECHNOLOGY - 2003, 2003, : 267 - 274
- [28] Calculating the mechanical strength of a covalent bond. ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2000, 219 : U325 - U325
- [29] THE SHEAR BOND STRENGTH OF MECHANICAL PULP FIBERS JOURNAL OF PULP AND PAPER SCIENCE, 1995, 21 (05): : J161 - J164