Simulating intrinsically AC-coupled hybrid pixel detectors

被引:3
|
作者
Bonvicini, V
Pindo, M
机构
[1] Ist Nazl Fis Nucl, Sez Trieste, I-34127 Trieste, Italy
[2] Univ Milan, I-20133 Milan, Italy
[3] Ist Nazl Fis Nucl, Sez MIlano, I-20133 Milan, Italy
来源
NUCLEAR INSTRUMENTS & METHODS IN PHYSICS RESEARCH SECTION A-ACCELERATORS SPECTROMETERS DETECTORS AND ASSOCIATED EQUIPMENT | 1998年 / 402卷 / 01期
关键词
D O I
10.1016/S0168-9002(97)01065-6
中图分类号
TH7 [仪器、仪表];
学科分类号
0804 ; 080401 ; 081102 ;
摘要
A bonding technique allowing AC-coupling of large hybrid pixel detectors in a simple and economic way is proposed. It consists in using a screen printing method to deposit non-conductive glue drops to interconnect diodes and VLSI cells. The AC-coupling can thus be achieved through the capacitance defined by the non-conductive glue drop realising the bonding itself. The feasibility of the proposed technique, together with its limitations, has been investigated by calculations and PSPICE simulations on a 5 x 5 pixel array.
引用
收藏
页码:53 / 66
页数:14
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