New high repetition rate, high energy 308 nm excimer laser for material processing

被引：0
|
作者：
Herbst, Ludolf [1 ]
Klaft, Ingo [1 ]
Schmidt, Kai [1 ]
Bragin, Igor [1 ]
Albrecht, Hans-Stephan [1 ]
机构：
[1] Coherent GmbH, Hans-Boeckler-Str 12, D-37079 Gottingen, Germany
来源：
LASER-BASED MICRO- AND NANOPACKAGING AND ASSEMBLY | 2007年 / 6459卷
关键词：
micro machining; UV laser; high power excimer; high repetition rate excimer;
D O I：
10.1117/12.717842
中图分类号：
TB3 [工程材料学];
学科分类号：
0805 ; 080502 ;
摘要：
High power excimer lasers are well established as work horses for various kinds of micro material processing. The applications are ranging from drilling holes, trench formation, thin film ablation to the crystallization of amorphous-Si into polycrystalline-Si. All applications use the high photon energy and large pulse power of the excimer technology. The increasing demand for micro scale products has let to the demand for UV lasers which support high throughput production. We report the performance parameters of a newly developed XeCl excimer laser with doubled repetition rate compared to available lasers. The developed laser system delivers up to 900 mJ stabilized pulse energy at 600 Hz repetition rate. The low jitter UV light source operates with excellent energy stability. The outstanding energy stability was reached by using a proprietary solid-state pulser discharge design.
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页数：8
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