Review of polymer materials with low dielectric constant

被引：180

作者：

Zhao, Xiong-Yan ^{[1
]}

Liu, Hong-Jie ^{[2
]}

机构：

[1] Hebei Univ Sci & Technol, Coll Mat Sci & Engn, Shijiazhuang 050018, Peoples R China

[2] Henkel Huawei Elect Co Ltd, Lianyungang 222006, Jiangsu, Peoples R China

来源：

POLYMER INTERNATIONAL | 2010年 / 59卷 / 05期

关键词：

polymeric dielectric materials; low dielectric constant; ultralarge-scale integration; electronic circuits; A-SIC-H; DIFFUSION BARRIER LAYER; LOW-K MATERIALS; THIN-FILMS; POLY(BINAPHTHYLENE ETHER); PLASMA TREATMENT; BACK-END; POROSITY; K-SIMILAR-TO-2.3; NANOINDENTATION;

D O I：

10.1002/pi.2809

中图分类号：

O63 [高分子化学（高聚物）];

学科分类号：

070305 ; 080501 ; 081704 ;

摘要：

One of the exciting and promising developments in material science today is the design and synthesis of novel low-dielectric-constant polymer materials, which are found to have potential applications in the field of ultralarge-scale integration, capacitors and other electronic circuits as insulating and/or dielectric materials. In this article the new polymer dielectric materials reported in recent years are reviewed, including aromatic (heteroaromatic) polymers, silicon-containing polymers, fluorinated polymers, porous polymers, etc. In summarizing the review, the development, potential applications and future directions of polymer materials with low dielectric constant are discussed. (C) 2010 Society of Chemical Industry

引用

页码：597 / 606

页数：10

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