Review of polymer materials with low dielectric constant

被引:180
|
作者
Zhao, Xiong-Yan [1 ]
Liu, Hong-Jie [2 ]
机构
[1] Hebei Univ Sci & Technol, Coll Mat Sci & Engn, Shijiazhuang 050018, Peoples R China
[2] Henkel Huawei Elect Co Ltd, Lianyungang 222006, Jiangsu, Peoples R China
关键词
polymeric dielectric materials; low dielectric constant; ultralarge-scale integration; electronic circuits; A-SIC-H; DIFFUSION BARRIER LAYER; LOW-K MATERIALS; THIN-FILMS; POLY(BINAPHTHYLENE ETHER); PLASMA TREATMENT; BACK-END; POROSITY; K-SIMILAR-TO-2.3; NANOINDENTATION;
D O I
10.1002/pi.2809
中图分类号
O63 [高分子化学(高聚物)];
学科分类号
070305 ; 080501 ; 081704 ;
摘要
One of the exciting and promising developments in material science today is the design and synthesis of novel low-dielectric-constant polymer materials, which are found to have potential applications in the field of ultralarge-scale integration, capacitors and other electronic circuits as insulating and/or dielectric materials. In this article the new polymer dielectric materials reported in recent years are reviewed, including aromatic (heteroaromatic) polymers, silicon-containing polymers, fluorinated polymers, porous polymers, etc. In summarizing the review, the development, potential applications and future directions of polymer materials with low dielectric constant are discussed. (C) 2010 Society of Chemical Industry
引用
收藏
页码:597 / 606
页数:10
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