Peltier Elements vs. Heat Sink in Cooling of High Power LEDs

被引:0
|
作者
Badalan , Niculina [1 ]
Svasta, Paul [1 ]
机构
[1] Univ Politehn Bucuresti, Ctr Technol Elect & Interconnect Tech, Bucharest, Romania
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
LEDs generate visible light when current passes across the junction of the semiconductor chip. LEDs are not 100 % efficient; much of the power running through an LED is lost as heat, which thus needs to be evacuated. This paper made a comparison between a light fixture that uses Peltier element and a light fixture cooled by heat sink. This paper shows how the Peltier element can contribute to LEDs function optimally at low temperature. The idea of using the Peltier effect for cooling LEDs is not new: there is a patent to this (US 6964501 [1]). This paper refers to a high power LED which requires a very high value of the heat to be evacuated (20 W) on a very small area (phi=18 mm) and compare the results with those obtained from measurements made on the same LED without Peltier element. This paper examines how Peltier elements can cool high power LEDs without consuming energy more than LED, without increasing too much the lamp size (LED and cooling system) and investigates the way to remove heat without added complexity. Finally the paper presents the measurement results according to the developed vehicle test.
引用
收藏
页码:124 / 128
页数:5
相关论文
共 50 条
  • [41] Use of Cooling Thermal Storage as a Heat Sink for Steam Power Plant
    Hegazy, Ahmed Sabry
    JOURNAL OF THERMAL SCIENCE AND TECHNOLOGY, 2008, 3 (02): : 330 - 341
  • [42] Thermal Characterization of a Copper Microchannel Heat Sink for Power Electronics Cooling
    Singh, Randeep
    Akbarzadeh, Aliakbar
    Mochizuki, Masataka
    Nguyen, Thang
    Nguyen, Tien
    JOURNAL OF THERMOPHYSICS AND HEAT TRANSFER, 2009, 23 (02) : 371 - 380
  • [43] Remote heat sink concepts for high power heat rejection
    Webb, RL
    Yamauchi, S
    THERMAL CHALLENGES IN NEXT GENERATION ELECTRONIC SYSTEMS, 2002, : 307 - 315
  • [44] Remote heat sink concept for high power heat rejection
    Webb, RL
    Yamauchi, S
    Denko, S
    Tochigi, KK
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2002, 25 (04): : 608 - 614
  • [45] Direct Bonding of Alumina Substrate with Copper Heat Sink in Air Assisted by Ultrasonic vibrations for High Power LEDs Devices
    Ji, Hongjun
    Cheng, Xiao
    Chen, Hao
    Li, Mingyu
    Li, Qingtao
    2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2013, : 1158 - +
  • [46] Finite Element Simulation of the Machining Process of Boiling Structures in a Novel Radial Heat Sink for High-Power LEDs
    Xiang, Jianhua
    Liu, Zeyu
    Zhang, Chunliang
    Zhou, Chao
    Chen, Conggui
    MATERIALS, 2020, 13 (18)
  • [47] Modelling of a micro-channel heat sink for cooling of high-power laser diode arrays
    Furmanski, Piotr
    Thualfaqir, Kadhim
    Lapka, Piotr
    ARCHIVES OF THERMODYNAMICS, 2018, 39 (03) : 15 - 27
  • [48] Thermal hydraulic performance of a microchannel heat sink for cooling a high-power diode laser bar
    Wu, Di-Hai
    Zah, Chung-En
    Liu, Xingsheng
    APPLIED OPTICS, 2019, 58 (08) : 1966 - 1977
  • [49] Geometric optimization of the heat sink for cooling high power IGBTs modules used in the arm solar converter
    Haraka, Fadwa
    Elouatouati, Ahmad
    Taha Janan, Mourad
    2017 14TH INTERNATIONAL MULTI-CONFERENCE ON SYSTEMS, SIGNALS & DEVICES (SSD), 2017, : 128 - 131
  • [50] Investigation of Heat Dissipation Limits for High Power LEDs
    Niculina, Badalan
    Constantin, Ropoteanu
    Cristina, Marghescu
    2016 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS, COMPUTERS AND ARTIFICIAL INTELLIGENCE (ECAI), 2016,