A new low-loss microstrip structure on LTCC substrate

被引：0
|
作者：
Lee, YC
Eun, KC
Park, CS
机构：
来源：
IEICE TRANSACTIONS ON ELECTRONICS | 2003年 / E86C卷 / 05期
关键词：
void cavity; LTCC; resonator; microstrip line; dielectric loss;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
We have devised and implemented a new low-loss microstrip transmission structure on LTCC substrate by including void cavities in the dielectric layer between conductor strip and ground plane. Measurements of lambda/4 T-resonators with the novel microstrip structure reveal total loss of 0.0126 dB/mm and Q-factor of 267 at 15.85GHz. The dielectric loss is analyzed as small as 0.0005 dB/mm at the frequency, and that is equivalent to an improvement of a factor of 18 compared to the conventional LTCC microstrip structure. The proposed microstrip structure with the embedded void cavities is suited for low loss LTCC based RF-MCM applications.
引用
收藏
页码：867 / 869
页数：3
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