Creep behavior and deformation mechanism map of Sn-Pb eutectic solder alloy

In this study, a large number of creep tests were carried out using miniature specimens in order to investigate the creep behavior of 63Sn/37Pb eutectic solder alloy over a wide temperature range from -40 to 150degreesC and stress range from 0.75 to 70 MPa. Based on dislocation and diffusion theories, two unified constitutive models were developed to describe the dislocation-controlled and diffusion-controlled creep behaviors observed. It was found that the two models accurately predict the experimental data. A deformation mechanism map was established for this eutectic solder alloy in order to interpret the creep mechanism under different temperature and loading conditions.