共 50 条
- [41] Single-chip condenser microphone using porous silicon as sacrificial layer for the air gap MICRO ELECTRO MECHANICAL SYSTEMS - IEEE ELEVENTH ANNUAL INTERNATIONAL WORKSHOP PROCEEDINGS, 1998, : 591 - 596
- [44] DESIGN OF CAPACITIVE MEMS MICROPHONE FOR FULLY IMPLANTABLE COCHLEAR IMPLANTS 2020 IEEE INTERNATIONAL CONFERENCE ON SEMICONDUCTOR ELECTRONICS (ICSE 2020), 2020, : 156 - 159
- [45] Design and fabrication of high sensitive microphone diaphragm using deep corrugation technique Microsystem Technologies, 2004, 10 : 142 - 146
- [46] Design and fabrication of high sensitive microphone diaphragm using deep corrugation technique MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2004, 10 (02): : 142 - 146
- [47] Fabrication of integrated single-chip Fourier spectrometers NANOENGINEERING: FABRICATION, PROPERTIES, OPTICS, THIN FILMS, AND DEVICES XVI, 2019, 11089
- [48] Design and modeling of a frog-shape MEMS capacitive microphone using SOI technology MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2018, 24 (02): : 1061 - 1070
- [49] Design and modeling of a frog-shape MEMS capacitive microphone using SOI technology Microsystem Technologies, 2018, 24 : 1061 - 1070
- [50] Stress analysis of a novel MEMS microphone chip using finite element analysis Electronic and Photonic Packaging, Integration and Packaging of MICRO/NANO/Electronic Systems, 2005, : 259 - 267