共 50 条
- [31] Thermal Stress Analysis and Structural Optimization of Ultra-thin Chip Stacked Package Device 2009 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2009), 2009, : 1109 - 1113
- [34] Linearized analysis of the deformation of ultra-thin lubricant films under gas pressures by the long wave equation Microsystem Technologies, 2007, 13 : 1339 - 1345
- [35] Linearized analysis of the deformation of ultra-thin lubricant films under gas pressures by the long wave equation MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2007, 13 (8-10): : 1339 - 1345
- [39] STRESS AND DEFORMATION ANALYSIS OF A U-SHAPED THIN AQUEDUCT BASED ON SHELL ELEMENT CIVIL ENGINEERING JOURNAL-STAVEBNI OBZOR, 2023, 32 (02): : 137 - 146
- [40] A quantitative analysis of stress-induced leakage currents in ultra-thin silicon dioxide films SOLID-STATE AND INTEGRATED-CIRCUIT TECHNOLOGY, VOLS 1 AND 2, PROCEEDINGS, 2001, : 958 - 963