Highly Robust Nanoscale Planar Double-Gate MOSFET Device and SRAM Cell Immune to Gate-Misalignment and Process Variations

被引:0
|
作者
Sachid, Angada B. [1 ]
Kulkarni, Giri S. [1 ]
Baghini, Maryam S. [1 ]
Sharma, Dinesh K. [1 ]
Rao, V. Ramgopal [1 ]
机构
[1] Indian Inst Technol, Dept Elect Engn, Ctr Excellence Nanoelect, Bombay 400076, Maharashtra, India
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中图分类号
TP301 [理论、方法];
学科分类号
081202 ;
摘要
Gate misalignment and process variations are important challenges in sub-20 nm gate length planar double-gate (DG) MOSFET devices For the first time, we demonstrate a misalignment- and process variations-aware device optimization strategy for a DG-MOSFET Using underlaps and high-kappa offset-spacers, we show that the robustness of the device to gate misalignment and process variations can be improved. A standard 6T-SRAM cell designed using the optimized devices shows better read and hold static noise margins, and lower variations in SNM and leakage power compared to a conventional DG-MOSFET.
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页码:13 / 16
页数:4
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