Analysis of On-Chip Copper-Single-Walled Carbon Nanotube Composite Interconnects Using Transmission Line Model

被引：0
|
作者：
Gao, X. [1 ]
Zheng, J. [1 ]
Zhao, W. -S. [1 ]
Wang, G. [1 ]
机构：
[1] Hangzhou Dianzi Univ, Sch Elect & Informat, Microelect CAD Ctr, Key Lab RF Circuits & Syst,Minist Educ, Hangzhou 310018, Zhejiang, Peoples R China
来源：
2016 PROGRESS IN ELECTROMAGNETICS RESEARCH SYMPOSIUM (PIERS) | 2016年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this paper, on-chip interconnects based on Cu-single-walled carbon nanotube (SWCNT) composite are studied using transmission line model. The transfer function is obtained and approximated by a linear parameter expression. The relative stability analysis of Cu-SWCNT composite interconnects is carried out by the Nyquist criteria.
引用
收藏
页码：2164 / 2167
页数：4
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