Electrical Modeling of On-Chip Copper-Carbon Nanotube Composite Interconnects

被引：0

作者：

Gao, Xuan ^{[1
]}

Zheng, Jie ^{[1
]}

Zhao, Wen-Sheng ^{[1
]}

Wang, Gaofeng ^{[1
]}

机构：

[1] Hangzhou Dianzi Univ, Microelect CAD Ctr, Sch Elect & Informat, Minist Educ,Key Lab RF Circuits & Syst, Hangzhou 310037, Zhejiang, Peoples R China

来源：

2016 ASIA-PACIFIC INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (APEMC) | 2016年

关键词：

Copper-carbon nanotube (Cu-CNT) composite; on-chip interconnects; equivalent circuit model; delay;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this paper, the electrical modeling of on-chip copper-carbon nanotube (Cu-CNT) composite interconnects are carried out based on the equivalent circuit model. The effective resistivity and propagation delay of a driven long Cu-CNT composite interconnect versus length have been captured and studied. The obtained results show that with the length increasing, the Cu-CNT composite can provide superior performance over the pure CNTs in the advanced integrated circuits.

引用

页码：229 / 231

页数：3

共 50 条

[1] Performance Modeling for carbon nanotube interconnects in on-chip power distribution
Naeemi, Azad
Huang, Gang
Meindl, James D.
[J]. 57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS, 2007, : 420 - +
[2] Stability Analysis of Coupled Copper-Carbon Nanotube (Cu-CNT) Composite Interconnects
Yang, Qiu-Yi
Cheng, Zi-Han
Zhao, Wen-Sheng
Wang, Gaofeng
[J]. 2017 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM (EDAPS), 2017,
[3] Modeling carbon nanotube bundles for future on-chip nano-interconnects
Chiariello, Andrea G.
Maffucci, Antonio
Miano, Giovanni
[J]. 2011 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS SYMPOSIUM (EDAPS), 2011,
[4] Application of Copper-Carbon Nanotubes Composite in Packaging Interconnects
Aryasomayajula, Lavanya
Rieske, Ralf
Wolter, Klaus-Juergen
[J]. 2011 34TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE 2011) - NEW TRENDS IN MICRO/NANOTECHNOLOGY, 2011, : 531 - 536
[5] Investigation of Copper-Carbon Nanotube Composites as Global VLSI Interconnects
Cheng, Zi-Han
Zhao, Wen-Sheng
Dong, Linxi
Wang, Jing
Zhao, Peng
Gao, Haijun
Wang, Gaofeng
[J]. IEEE TRANSACTIONS ON NANOTECHNOLOGY, 2017, 16 (06) : 891 - 900
[6] Electrical analysis of single-walled carbon nanotube as gigahertz on-chip interconnects
Chowdhury, Zamshed Iqbal
Rahaman, Md. Istiaque
Kaiser, M. Shamim
[J]. FRONTIERS OF INFORMATION TECHNOLOGY & ELECTRONIC ENGINEERING, 2017, 18 (02) : 262 - 271
[7] Electrical analysis of single-walled carbon nanotube as gigahertz on-chip interconnects
Zamshed Iqbal Chowdhury
Md. Istiaque Rahaman
M. Shamim Kaiser
[J]. Frontiers of Information Technology & Electronic Engineering, 2017, 18 : 262 - 271
[8] Analysis of On-Chip Copper-Single-Walled Carbon Nanotube Composite Interconnects Using Transmission Line Model
Gao, X.
Zheng, J.
Zhao, W. -S.
Wang, G.
[J]. 2016 PROGRESS IN ELECTROMAGNETICS RESEARCH SYMPOSIUM (PIERS), 2016, : 2164 - 2167
[9] Carbon-nanotube-based wireless on-chip interconnects
Franck, P.
Baillargeat, D.
Tay, B. K.
[J]. 2016 IEEE MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM (IMS), 2016,
[10] Signal Integrity Analysis of Carbon Nanotube on-chip Interconnects
Chiariello, A. G.
Maffucci, A.
Miano, G.
[J]. 2009 IEEE WORKSHOP ON SIGNAL PROPAGATION ON INTERCONNECTS, 2009, : 33 - +

← 1 2 3 4 5 →