Characterization of Low-Inductance SiC Module With Integrated Capacitors for Aircraft Applications Requiring Low Losses and Low EMI Issues

被引:25
|
作者
Cougo, Bernardo [1 ]
Sathler, Hans Hoffmann [1 ]
Riva, Raphael [1 ]
Dos Santos, Victor [1 ,2 ]
Roux, Nicolas [3 ]
Sareni, Bruno [3 ]
机构
[1] IRT St Exupery, F-31405 Toulouse, France
[2] SAFRAN SA, F-31700 Blagnac, France
[3] Laplace, Laplace Lab, F-31071 Toulouse, France
关键词
Switches; Silicon carbide; Aircraft; Multichip modules; MOSFET; Switching loss; Electromagnetic interference (EMI); low-inductance module; loss measurement; more electrical aircraft (MEA); modified opposition method (MOM); silicon carbide (SiC) module; switching energy; POWER-DENSITY;
D O I
10.1109/TPEL.2020.3014529
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Future aircrafts will be composed of high number of power converters having always higher power density and efficiency. In order to increase performance of such converters, a good option is the use of silicon carbide (SiC) transistors. Although these components reduce losses when compared to their silicon-based counterpart, they increase switching speed and overshoot during commutation, which can cause serious electromagnetic interference issues and overvoltages on loads connected to these converters. For that reason, power modules containing SiC transistors must have the lowest possible parasitic inductance. This article presents a multilevel low-inductance SiC power module designed to optimize a three-phase 540 V/15 kVA inverter for modern aircrafts. Precise dynamic characterization is performed in order to accurately determine switching energies and to show improvement of loss performance of this power module when compared to discrete components and also to power modules from the market. Inverter input and output common mode current reduction due to integrated common mode capacitors in the power module is experimentally shown.
引用
收藏
页码:8230 / 8242
页数:13
相关论文
共 50 条
  • [41] A Highly Integrated GaN Power Module with Low Parasitic Inductance and High Thermal Performance
    Kong, Hang
    Yang, Fengtao
    Yang, Chengzi
    Zhang, Yifan
    Wang, Zhenyu
    Yao, Yilong
    Wang, Yan
    Wang, Laili
    2022 IEEE ENERGY CONVERSION CONGRESS AND EXPOSITION (ECCE), 2022,
  • [42] Low-Inductance Double-Sided Cooling Power Module with Branched Lead Frame Terminals for EV Traction Inverter
    Tokuyama, Takeshi
    Mima, Akira
    Takagi, Yusuke
    Matsushita, Akira
    2020 IEEE ENERGY CONVERSION CONGRESS AND EXPOSITION (ECCE), 2020, : 3987 - 3991
  • [43] High-Bandwidth Low-Inductance Current Shunt for Wide-Bandgap Devices Dynamic Characterization
    Zhang, Wen
    Zhang, Zheyu
    Wang, Fred
    Brush, Edward V.
    Forcier, Neil
    IEEE TRANSACTIONS ON POWER ELECTRONICS, 2021, 36 (04) : 4522 - 4531
  • [44] Fast Switching Planar Power Module With SiC MOSFETs and Ultra-low Parasitic Inductance
    Risseh, Arash Edvin
    Nee, Hans-Peter
    Kostov, Konstantin
    2018 INTERNATIONAL POWER ELECTRONICS CONFERENCE (IPEC-NIIGATA 2018 -ECCE ASIA), 2018, : 2732 - 2737
  • [45] High-speed and Low Switching Loss Operation of 1700 V 60 A SiC MOSFETs Installed in Low Parasitic Inductance Module
    Kono, Hiroshi
    Takao, Kazuto
    Suzuki, Takuma
    Shinohe, Takashi
    2014 IEEE 26TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES & IC'S (ISPSD), 2014, : 289 - 292
  • [46] Design of Low Inductance SiC-MOS/Si-IGBT Hybrid Module for PV Inverters
    Wang, Ye
    Chen, Min
    Xu, Dehong
    IEEE OPEN JOURNAL OF POWER ELECTRONICS, 2022, 3 : 942 - 954
  • [47] Miniaturised "low profile" module integrated converter for photovoltaic applications with integrated magnetic components
    Meinhardt, M
    O'Donnell, T
    Schneider, H
    Flannery, J
    Mathuna, CO
    Zacharias, P
    Krieger, T
    APEC'99: FOURTEENTH ANNUAL APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION, CONFERENCE PROCEEDINGS, VOLS 1 & 2, 1999, : 305 - 311
  • [48] Miniaturized `low profile' Module Integrated Converter for photovoltaic applications with integrated magnetic components
    Meinhardt, Mike
    O'Donnell, Terence
    Schneider, Henning
    Flannery, John
    O Mathuna, Cian
    Zacharias, Peter
    Krieger, Thomas
    Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC, 1999, 1 : 305 - 311
  • [49] Compact Sandwiched Press-Pack SiC Power Module With Low Stray Inductance and Balanced Thermal Stress
    Chang, Yao
    Luo, Haoze
    Iannuzzo, Francesco
    Bahman, Amir Sajjad
    Li, Wuhua
    He, Xiangning
    Blaabjerg, Frede
    IEEE TRANSACTIONS ON POWER ELECTRONICS, 2020, 35 (03) : 2237 - 2241
  • [50] Electrical Performance Advancement in SiC Power Module Package Design With Kelvin Drain Connection and Low Parasitic Inductance
    Yang, Fei
    Wang, Zhiqiang
    Liang, Zhenxian
    Wang, Fei
    IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, 2019, 7 (01) : 84 - 98