Chip Temperature Optimization for Dark Silicon Many-Core Systems

被引:16
|
作者
Li, Mengquan [1 ]
Liu, Weichen [2 ]
Yang, Lei [1 ]
Chen, Peng [1 ]
Chen, Chao [1 ]
机构
[1] Chongqing Univ, Coll Comp Sci, Chongqing 400044, Peoples R China
[2] Nanyang Technol Univ, Sch Comp Sci & Engn, Singapore 639798, Singapore
基金
中国国家自然科学基金;
关键词
Chip temperature optimization; dark silicon; mixed integer linear programming (MILP) model; thermal model; POWER MANAGEMENT; ON-CHIP; NETWORK;
D O I
10.1109/TCAD.2017.2740306
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
In the dark silicon era, a fundamental problem is given a real-time computation demand, how to determine if an on-chip multiprocessor system is able to accept this demand and to maintain its reliability by keeping every core within a safe temperature range. In this paper, a practical thermal model is described for quick chip temperature prediction. Integrated with the thermal model, we present a mixed integer linear programming (MILP) model to find the optimal task-to-core assignment with the minimum chip peak temperature. For the worst case where even the minimum chip peak temperature exceeds the safe temperature, a heuristic algorithm, called temperaturec-onstrained task selection (TCTS), is proposed to optimize the system performance within chip safe temperature. The optimality of the TCTS algorithm is formally proven. Extensive performance evaluations show that our thermal model achieves an average prediction accuracy of 0.0741 degrees C within 0.2392 ms. The MILP model reduces chip peak temperature of similar to 10 degrees C comparing with traditional techniques. The system performance is increased by 19.8% under safe temperature limitation. Due to the satisfying scalability of our MILP formulation, the chip peak temperature is further decreased by 5.06 degrees C via the TCTS algorithm. The feasibility of this systematical technique is testified in a real case study as well.
引用
收藏
页码:941 / 953
页数:13
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